
AMD Xilinx
XC4028XLA-08BGG256C
XC4028XLA-08BGG256C ECAD Model
XC4028XLA-08BGG256C Attributes
Type | Description | Select |
---|---|---|
Pbfree Code | Yes | |
Rohs Code | Yes | |
Part Life Cycle Code | Obsolete | |
Supply Voltage-Nom | 3.3 V | |
Number of Equivalent Gates | 18000 | |
Number of CLBs | 1024 | |
Combinatorial Delay of a CLB-Max | 1 ns | |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
Temperature Grade | OTHER | |
Package Shape | SQUARE | |
Technology | CMOS | |
Organization | 1024 CLBS, 18000 GATES | |
Additional Feature | CAN ALSO USE 50000 GATES | |
Clock Frequency-Max | 263 MHz | |
Supply Voltage-Max | 3.6 V | |
Supply Voltage-Min | 3 V | |
JESD-30 Code | S-PBGA-B256 | |
Qualification Status | Not Qualified | |
JESD-609 Code | e1 | |
Moisture Sensitivity Level | 3 | |
Operating Temperature-Max | 85 °C | |
Peak Reflow Temperature (Cel) | 250 | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Number of Terminals | 256 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY | |
Surface Mount | YES | |
Terminal Finish | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | |
Terminal Form | BALL | |
Terminal Pitch | 1.27 mm | |
Terminal Position | BOTTOM | |
Width | 27 mm | |
Length | 27 mm | |
Seated Height-Max | 2.55 mm | |
Ihs Manufacturer | XILINX INC | |
Part Package Code | BGA | |
Package Description | BGA, | |
Pin Count | 256 | |
Reach Compliance Code | compliant | |
HTS Code | 8542.39.00.01 |
XC4028XLA-08BGG256C Datasheet Download
XC4028XLA-08BGG256C Overview
The XC4028XLA-08BGG256C chip model is a powerful solution for advanced communication systems. It was designed with the intention of providing a high-performance, low-cost solution for a wide range of applications. It is capable of providing a high-speed, low-latency connection to a wide range of devices, including those used in communication networks.
The XC4028XLA-08BGG256C chip model is equipped with a wide range of features, including a dual-core processor, a large memory capacity, and a wide range of communication interfaces. This makes it a great choice for a wide range of applications, such as high-speed networking, advanced communication, and multimedia applications. It is also capable of providing a high-speed, low-latency connection to a wide range of devices, including those used in communication networks.
The XC4028XLA-08BGG256C chip model is also capable of being upgraded in the future. This is due to its modular design, which allows for the addition of new features and functions as needed. This makes it a great choice for those who need a powerful solution for their communication needs, and who want to be able to upgrade their system as technology advances.
The XC4028XLA-08BGG256C chip model is also capable of being used in intelligent scenarios. This is due to its advanced features, such as its ability to process data quickly and accurately, and its ability to connect to a wide range of devices. This makes it a great choice for those who need to connect to a wide range of devices, such as those used in communication networks, and who need to be able to process data quickly and accurately.
The XC4028XLA-08BGG256C chip model is also capable of being used in the era of fully intelligent systems. This is due to its advanced features, such as its ability to process data quickly and accurately, and its ability to connect to a wide range of devices. This makes it a great choice for those who need to connect to a wide range of devices, such as those used in communication networks, and who need to be able to process data quickly and accurately.
In addition to its features, the XC4028XLA-08BGG256C chip model also has specific design requirements. These requirements include a high-speed, low-latency connection to a wide range of devices, a large memory capacity, and a wide range of communication interfaces. It is also important to note that the chip model is designed to be compatible with a wide range of operating systems and platforms.
Finally, when considering the XC4028XLA-08BGG256C chip model, it is important to understand the actual case studies and precautions that should be taken. This includes understanding the potential risks associated with the chip model, such as potential data loss or damage, as well as understanding the potential security risks. It is also important to understand the potential compatibility issues that may arise when using the chip model with other devices or systems.
In conclusion, the XC4028XLA-08BGG256C chip model is a powerful solution for advanced communication systems. It was designed with the intention of providing a high-performance, low-cost solution for a wide range of applications. It is capable of providing a high-speed, low-latency connection to a wide range of devices, including those used in communication networks. It is also capable of being upgraded in the future, and is capable of being used in intelligent scenarios and in the era of fully intelligent systems. Finally, it is important to understand the actual case studies and precautions that should be taken when considering the XC4028XLA-08BGG256C chip model.
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