XC4028XLA-08BGG256C
XC4028XLA-08BGG256C
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rohs

AMD Xilinx

XC4028XLA-08BGG256C


XC4028XLA-08BGG256C
F20-XC4028XLA-08BGG256C
Active
FIELD PROGRAMMABLE GATE ARRAY, CMOS, BGA
BGA

XC4028XLA-08BGG256C ECAD Model


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XC4028XLA-08BGG256C Attributes


Type Description Select
Pbfree Code Yes
Rohs Code Yes
Part Life Cycle Code Obsolete
Supply Voltage-Nom 3.3 V
Number of Equivalent Gates 18000
Number of CLBs 1024
Combinatorial Delay of a CLB-Max 1 ns
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Temperature Grade OTHER
Package Shape SQUARE
Technology CMOS
Organization 1024 CLBS, 18000 GATES
Additional Feature CAN ALSO USE 50000 GATES
Clock Frequency-Max 263 MHz
Supply Voltage-Max 3.6 V
Supply Voltage-Min 3 V
JESD-30 Code S-PBGA-B256
Qualification Status Not Qualified
JESD-609 Code e1
Moisture Sensitivity Level 3
Operating Temperature-Max 85 °C
Peak Reflow Temperature (Cel) 250
Time@Peak Reflow Temperature-Max (s) 30
Number of Terminals 256
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Shape SQUARE
Package Style GRID ARRAY
Surface Mount YES
Terminal Finish Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)
Terminal Form BALL
Terminal Pitch 1.27 mm
Terminal Position BOTTOM
Width 27 mm
Length 27 mm
Seated Height-Max 2.55 mm
Ihs Manufacturer XILINX INC
Part Package Code BGA
Package Description BGA,
Pin Count 256
Reach Compliance Code compliant
HTS Code 8542.39.00.01

XC4028XLA-08BGG256C Datasheet Download


XC4028XLA-08BGG256C Overview



The XC4028XLA-08BGG256C chip model is a powerful solution for advanced communication systems. It was designed with the intention of providing a high-performance, low-cost solution for a wide range of applications. It is capable of providing a high-speed, low-latency connection to a wide range of devices, including those used in communication networks.


The XC4028XLA-08BGG256C chip model is equipped with a wide range of features, including a dual-core processor, a large memory capacity, and a wide range of communication interfaces. This makes it a great choice for a wide range of applications, such as high-speed networking, advanced communication, and multimedia applications. It is also capable of providing a high-speed, low-latency connection to a wide range of devices, including those used in communication networks.


The XC4028XLA-08BGG256C chip model is also capable of being upgraded in the future. This is due to its modular design, which allows for the addition of new features and functions as needed. This makes it a great choice for those who need a powerful solution for their communication needs, and who want to be able to upgrade their system as technology advances.


The XC4028XLA-08BGG256C chip model is also capable of being used in intelligent scenarios. This is due to its advanced features, such as its ability to process data quickly and accurately, and its ability to connect to a wide range of devices. This makes it a great choice for those who need to connect to a wide range of devices, such as those used in communication networks, and who need to be able to process data quickly and accurately.


The XC4028XLA-08BGG256C chip model is also capable of being used in the era of fully intelligent systems. This is due to its advanced features, such as its ability to process data quickly and accurately, and its ability to connect to a wide range of devices. This makes it a great choice for those who need to connect to a wide range of devices, such as those used in communication networks, and who need to be able to process data quickly and accurately.


In addition to its features, the XC4028XLA-08BGG256C chip model also has specific design requirements. These requirements include a high-speed, low-latency connection to a wide range of devices, a large memory capacity, and a wide range of communication interfaces. It is also important to note that the chip model is designed to be compatible with a wide range of operating systems and platforms.


Finally, when considering the XC4028XLA-08BGG256C chip model, it is important to understand the actual case studies and precautions that should be taken. This includes understanding the potential risks associated with the chip model, such as potential data loss or damage, as well as understanding the potential security risks. It is also important to understand the potential compatibility issues that may arise when using the chip model with other devices or systems.


In conclusion, the XC4028XLA-08BGG256C chip model is a powerful solution for advanced communication systems. It was designed with the intention of providing a high-performance, low-cost solution for a wide range of applications. It is capable of providing a high-speed, low-latency connection to a wide range of devices, including those used in communication networks. It is also capable of being upgraded in the future, and is capable of being used in intelligent scenarios and in the era of fully intelligent systems. Finally, it is important to understand the actual case studies and precautions that should be taken when considering the XC4028XLA-08BGG256C chip model.



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