AMD Xilinx
XC4028XLA-08BG352I
XC4028XLA-08BG352I ECAD Model
XC4028XLA-08BG352I Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 3.3 V | |
| Number of Inputs | 256 | |
| Number of Outputs | 256 | |
| Number of Logic Cells | 1024 | |
| Number of Equivalent Gates | 18000 | |
| Number of CLBs | 1024 | |
| Combinatorial Delay of a CLB-Max | 1 ns | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 1024 CLBS, 18000 GATES | |
| Additional Feature | CAN ALSO USE 50000 GATES | |
| Clock Frequency-Max | 263 MHz | |
| Power Supplies | 3.3 V | |
| Supply Voltage-Max | 3.6 V | |
| Supply Voltage-Min | 3 V | |
| JESD-30 Code | S-PBGA-B352 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 3 | |
| Peak Reflow Temperature (Cel) | 225 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 352 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LBGA | |
| Package Equivalence Code | BGA352,26X26,50 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, LOW PROFILE | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Lead (Sn63Pb37) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1.27 mm | |
| Terminal Position | BOTTOM | |
| Width | 35 mm | |
| Length | 35 mm | |
| Seated Height-Max | 1.7 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | PLASTIC, BGA-352 | |
| Pin Count | 352 | |
| Reach Compliance Code | not_compliant | |
| HTS Code | 8542.39.00.01 |
XC4028XLA-08BG352I Datasheet Download
XC4028XLA-08BG352I Overview
The XC4028XLA-08BG352I chip model is a high-performance digital signal processor developed by Xilinx, one of the leading providers of programmable logic devices. It is designed to offer a flexible solution for embedded processing, image processing, and other high-performance digital signal processing applications. This chip model requires the use of HDL language for programming, allowing for more complex and sophisticated designs.
The original design intention of the XC4028XLA-08BG352I chip model was to provide a flexible and powerful solution for digital signal processing applications. It is capable of providing high-speed processing, low power consumption, and reliable performance. Furthermore, this chip model can be easily upgraded and expanded, allowing for future growth and development. This makes it an ideal choice for a wide range of applications, including advanced communication systems.
This chip model is also suitable for the development and popularization of future intelligent robots. It can be used to create sophisticated and powerful robots that can perform a variety of tasks. In order to use the XC4028XLA-08BG352I chip model effectively, it requires the use of specialized technical talents, such as engineers and programmers who are familiar with HDL language.
In conclusion, the XC4028XLA-08BG352I chip model is an ideal choice for a wide range of applications, including high-performance digital signal processing, embedded processing, image processing, and advanced communication systems. It is also suitable for the development and popularization of future intelligent robots. In order to use this chip model effectively, it requires the use of specialized technical talents, such as engineers and programmers who are familiar with HDL language.
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