AMD Xilinx
XC4028XLA-07BGG352C
XC4028XLA-07BGG352C ECAD Model
XC4028XLA-07BGG352C Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 3.3 V | |
| Number of Equivalent Gates | 18000 | |
| Number of CLBs | 1024 | |
| Combinatorial Delay of a CLB-Max | 900 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 1024 CLBS, 18000 GATES | |
| Additional Feature | CAN ALSO USE 50000 GATES | |
| Clock Frequency-Max | 294 MHz | |
| Supply Voltage-Max | 3.6 V | |
| Supply Voltage-Min | 3 V | |
| JESD-30 Code | S-PBGA-B352 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | 245 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 352 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LBGA | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, LOW PROFILE | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1.27 mm | |
| Terminal Position | BOTTOM | |
| Width | 35 mm | |
| Length | 35 mm | |
| Seated Height-Max | 1.7 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | LBGA, | |
| Pin Count | 352 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 |
XC4028XLA-07BGG352C Datasheet Download
XC4028XLA-07BGG352C Overview
The XC4028XLA-07BGG352C chip model is a powerful and efficient tool for various industries. Developed by Xilinx, this chip model is based on the 28nm process technology and has a wide range of applications, from networking to embedded systems. It has several advantages that make it an ideal choice for various industries.
First, the XC4028XLA-07BGG352C chip model is highly efficient in terms of power consumption. It has a low power consumption of up to 4.5W, making it suitable for a wide range of applications. This is especially important for embedded and networking systems, where power consumption is a major factor.
Second, the XC4028XLA-07BGG352C chip model is highly flexible. It is designed to be easily reconfigurable, allowing users to adapt the chip model to their specific needs. This makes it highly suitable for different industries, such as automotive and industrial automation, where it can be used to create custom solutions.
Third, the XC4028XLA-07BGG352C chip model is highly reliable. It is designed to be highly reliable, with a high level of fault tolerance and a low failure rate. This makes it suitable for applications where reliability is a major factor, such as in medical and military applications.
The XC4028XLA-07BGG352C chip model has been designed with the intention of future upgrades and is expected to be a major part of the future of the industry. As technology advances, the chip model is expected to be used in more advanced communication systems, such as 5G networks and beyond. It is also expected to be used in fully intelligent systems, such as the Internet of Things (IoT) and Artificial Intelligence (AI).
In conclusion, the XC4028XLA-07BGG352C chip model is an efficient and reliable tool for various industries. It has several advantages, such as low power consumption, high flexibility, and high reliability, making it suitable for a wide range of applications. It is expected to be a major part of the industry in the future, as it is designed with the intention of future upgrades and is expected to be used in more advanced communication systems and fully intelligent systems.
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| QTY | Unit Price | Ext Price |
|---|---|---|
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