AMD Xilinx
XC4028XL-1BGG352C
XC4028XL-1BGG352C ECAD Model
XC4028XL-1BGG352C Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 3.3 V | |
| Number of Equivalent Gates | 18000 | |
| Number of CLBs | 1024 | |
| Combinatorial Delay of a CLB-Max | 1.3 ns | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 1024 CLBS, 18000 GATES | |
| Additional Feature | MAX USABLE 28000 LOGIC GATES | |
| Clock Frequency-Max | 200 MHz | |
| Supply Voltage-Max | 3.6 V | |
| Supply Voltage-Min | 3 V | |
| JESD-30 Code | S-PBGA-B352 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | 245 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 352 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LBGA | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, LOW PROFILE | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1.27 mm | |
| Terminal Position | BOTTOM | |
| Width | 35 mm | |
| Length | 35 mm | |
| Seated Height-Max | 1.7 mm | |
| Ihs Manufacturer | XILINX INC | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 | |
| Part Package Code | BGA | |
| Package Description | LBGA, | |
| Pin Count | 352 |
XC4028XL-1BGG352C Datasheet Download
XC4028XL-1BGG352C Overview
The XC4028XL-1BGG352C chip model is a high-performance, low-power device designed for digital signal processing, embedded processing, and image processing applications. It is a field programmable gate array (FPGA) device that is programmed using hardware description language (HDL). This chip model is ideal for applications that have high performance requirements and need to be implemented quickly.
The XC4028XL-1BGG352C chip model has several advantages that make it attractive for various applications. It is capable of operating at high clock speeds, has a large number of I/O pins, and is highly configurable. This allows for a wide range of applications in which the chip model can be used. Additionally, the chip model has low power consumption and is highly reliable, making it suitable for use in many different environments.
The demand for the XC4028XL-1BGG352C chip model is expected to increase in the near future, as more applications require the use of FPGAs. The chip model has been designed with scalability in mind, meaning that it can be easily upgraded to meet the needs of more advanced applications. This makes it an attractive option for companies looking to use the latest technology in their products.
The original design intention of the XC4028XL-1BGG352C chip model was to provide a high-performance, low-power device for digital signal processing, embedded processing, and image processing applications. It is capable of operating at high clock speeds and has a large number of I/O pins, making it suitable for a wide range of applications. Additionally, it has low power consumption and is highly reliable, making it suitable for many different environments.
The XC4028XL-1BGG352C chip model has the potential to be upgraded in the future to meet the needs of more advanced applications. This could include applications in advanced communication systems, such as 5G and beyond. The chip model is highly configurable, allowing for a wide range of applications in which it can be used. Additionally, its scalability means that it can be easily upgraded in the future to meet the needs of more advanced applications.
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| QTY | Unit Price | Ext Price |
|---|---|---|
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