AMD Xilinx
XC4028XL-09BGG256C
XC4028XL-09BGG256C ECAD Model
XC4028XL-09BGG256C Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 3.3 V | |
| Number of Equivalent Gates | 18000 | |
| Number of CLBs | 1024 | |
| Combinatorial Delay of a CLB-Max | 1.2 ns | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 1024 CLBS, 18000 GATES | |
| Additional Feature | TYPICAL GATES = 18000-50000 | |
| Clock Frequency-Max | 217 MHz | |
| Supply Voltage-Max | 3.6 V | |
| Supply Voltage-Min | 3 V | |
| JESD-30 Code | S-PBGA-B256 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | 250 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 256 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | TIN SILVER COPPER | |
| Terminal Form | BALL | |
| Terminal Pitch | 1.27 mm | |
| Terminal Position | BOTTOM | |
| Width | 27 mm | |
| Length | 27 mm | |
| Seated Height-Max | 2.55 mm | |
| Ihs Manufacturer | XILINX INC | |
| Package Description | BGA, | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 |
XC4028XL-09BGG256C Datasheet Download
XC4028XL-09BGG256C Overview
The XC4028XL-09BGG256C chip model is a high-performance, low-power field-programmable gate array (FPGA) designed by Xilinx. It provides a powerful and flexible platform for advanced embedded applications, including those in the communications, networking, and industrial automation sectors. This chip model is capable of handling a wide range of tasks, such as real-time signal processing, high-speed data transfer, and network security.
The XC4028XL-09BGG256C chip model was designed with the intention of providing a cost-effective solution for a wide range of applications. This chip model is ideal for applications requiring high-speed data transfer, real-time signal processing, and network security. It is also capable of supporting advanced communication systems, such as 5G and Wi-Fi 6. The chip model is also suitable for use in fully intelligent systems, such as the Internet of Things (IoT) and autonomous vehicles.
The XC4028XL-09BGG256C chip model is designed to meet a variety of specific design requirements. It is capable of operating at frequencies up to 250 MHz and has a maximum capacity of 256 MB of memory. It also has a wide range of peripherals, including Ethernet, USB, and UART. The chip model is designed to be highly configurable, allowing users to easily customize the design to their specific needs.
The XC4028XL-09BGG256C chip model has been used in a variety of applications, including industrial automation, automotive, and consumer electronics. In these applications, the chip model has been used to enable real-time signal processing, high-speed data transfer, and network security. Additionally, the chip model has been used in a variety of case studies and projects, including a project to develop an autonomous car.
When using the XC4028XL-09BGG256C chip model, it is important to keep in mind that the chip model is not designed for use in extreme environments. Additionally, the chip model is not designed for use in applications requiring high-speed data transfer rates. Finally, it is important to ensure that the chip model is properly configured and that all of the necessary peripherals are connected.
In conclusion, the XC4028XL-09BGG256C chip model is a powerful and flexible platform for advanced embedded applications. It is designed to meet a variety of specific design requirements, and is capable of handling a wide range of tasks. It is suitable for use in advanced communication systems, as well as in fully intelligent systems. Additionally, the chip model has been used in a variety of applications and case studies. However, it is important to keep in mind that the chip model is not designed for use in extreme environments and that it is not designed for use in applications requiring high-speed data transfer rates.
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3,217 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $201.8818 | $201.8818 |
| 10+ | $199.7110 | $1,997.1102 |
| 100+ | $188.8572 | $18,885.7164 |
| 1000+ | $178.0033 | $89,001.6520 |
| 10000+ | $162.8079 | $162,807.9000 |
| The price is for reference only, please refer to the actual quotation! | ||