AMD Xilinx
XC40250XV-09BG560I
XC40250XV-09BG560I ECAD Model
XC40250XV-09BG560I Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 2.5 V | |
| Number of Inputs | 448 | |
| Number of Outputs | 448 | |
| Number of Logic Cells | 8464 | |
| Number of Equivalent Gates | 180000 | |
| Number of CLBs | 8464 | |
| Combinatorial Delay of a CLB-Max | 1.3 ns | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 8464 CLBS, 180000 GATES | |
| Additional Feature | CAN ALSO USE 500000 GATES | |
| Clock Frequency-Max | 225 MHz | |
| Power Supplies | 2.5,3.3 V | |
| Supply Voltage-Max | 2.7 V | |
| Supply Voltage-Min | 2.3 V | |
| JESD-30 Code | S-PBGA-B560 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 3 | |
| Peak Reflow Temperature (Cel) | 225 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 560 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LBGA | |
| Package Equivalence Code | BGA560,33X33,50 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, LOW PROFILE | |
| Surface Mount | YES | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | BALL | |
| Terminal Pitch | 1.27 mm | |
| Terminal Position | BOTTOM | |
| Width | 42.5 mm | |
| Length | 42.5 mm | |
| Seated Height-Max | 1.7 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | PLASTIC, BGA-560 | |
| Pin Count | 560 | |
| Reach Compliance Code | not_compliant | |
| HTS Code | 8542.39.00.01 |
XC40250XV-09BG560I Datasheet Download
XC40250XV-09BG560I Overview
The XC40250XV-09BG560I chip model is an advanced piece of technology that has the potential to revolutionize the way we think about digital signal processing, embedded processing, and image processing. With its high-performance capabilities, this model is an ideal choice for those who need to take advantage of the latest technological developments.
The XC40250XV-09BG560I chip model is well-suited for applications in networks and intelligent scenarios. It can be used in the development and popularization of future intelligent robots, as well as in the era of fully intelligent systems. This chip model is also well-suited for use in the development of autonomous vehicles, as well as in the development of artificial intelligence.
Using the XC40250XV-09BG560I chip model effectively requires a certain level of technical talent. Those who are proficient in the use of HDL language, as well as in digital signal processing and embedded processing, will be able to make the most of this chip model. Additionally, those who are familiar with the development of autonomous vehicles, artificial intelligence, and other related technologies will also find this chip model to be a valuable asset.
In conclusion, the XC40250XV-09BG560I chip model is an advanced piece of technology that has the potential to revolutionize the way we think about digital signal processing, embedded processing, and image processing. With its high-performance capabilities, this model is an ideal choice for those who need to take advantage of the latest technological developments. Those who are proficient in the use of HDL language, as well as in digital signal processing and embedded processing, will be able to make the most of this chip model. Additionally, those who are familiar with the development of autonomous vehicles, artificial intelligence, and other related technologies will also find this chip model to be a valuable asset.
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Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| No reference price found. | ||