AMD Xilinx
XC40250XV-09BG560C
XC40250XV-09BG560C ECAD Model
XC40250XV-09BG560C Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 2.5 V | |
| Number of Inputs | 448 | |
| Number of Outputs | 448 | |
| Number of Logic Cells | 8464 | |
| Number of Equivalent Gates | 180000 | |
| Number of CLBs | 8464 | |
| Combinatorial Delay of a CLB-Max | 1.3 ns | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 8464 CLBS, 180000 GATES | |
| Additional Feature | CAN ALSO USE 500000 GATES | |
| Clock Frequency-Max | 225 MHz | |
| Power Supplies | 2.5,3.3 V | |
| Supply Voltage-Max | 2.7 V | |
| Supply Voltage-Min | 2.3 V | |
| JESD-30 Code | S-PBGA-B560 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | 225 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 560 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LBGA | |
| Package Equivalence Code | BGA560,33X33,50 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, LOW PROFILE | |
| Surface Mount | YES | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | BALL | |
| Terminal Pitch | 1.27 mm | |
| Terminal Position | BOTTOM | |
| Width | 42.5 mm | |
| Length | 42.5 mm | |
| Seated Height-Max | 1.7 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | PLASTIC, BGA-560 | |
| Pin Count | 560 | |
| Reach Compliance Code | not_compliant | |
| HTS Code | 8542.39.00.01 |
XC40250XV-09BG560C Datasheet Download
XC40250XV-09BG560C Overview
The chip model XC40250XV-09BG560C is a highly advanced and innovative chip model that has been designed to meet the ever-changing demands of the modern communication systems. It is a multi-function chip that has been designed to provide a wide range of features and capabilities, making it an ideal choice for a wide range of applications.
The XC40250XV-09BG560C is a high-performance, low-power chip that is capable of providing a wide range of features and capabilities. It includes a wide range of communication protocols, including Ethernet, USB, Bluetooth, Wi-Fi, and more. It also provides a wide range of analog and digital signal processing capabilities, including signal conditioning, signal detection, and signal conversion. Additionally, it provides a wide range of power management features, including power saving, power management, and power optimization.
The XC40250XV-09BG560C is designed to be used in a wide variety of applications, from consumer electronics to industrial and commercial applications. It is designed to be used in a wide variety of communication systems, including cellular, satellite, and wireless networks. It is also designed to be used in a wide variety of other applications, including automotive, medical, and industrial applications.
When it comes to the industry trends of the XC40250XV-09BG560C and the future development of related industries, it is important to consider the specific technologies that are needed. The XC40250XV-09BG560C is designed to be used in a wide variety of applications, and it is important to determine what specific technologies are needed in order to ensure that the chip can be used in the most efficient and effective manner. Additionally, it is important to consider the original design intention of the chip model and the possibility of future upgrades, as well as whether it can be used in advanced communication systems.
In order to ensure that the XC40250XV-09BG560C is used in the most effective manner, it is important to understand the product description and specific design requirements of the chip model. Additionally, it is important to consider actual case studies and the precautions that need to be taken in order to ensure that the chip is used in the most efficient and effective manner. It is also important to consider the various industry trends and the future development of related industries, as well as the specific technologies that are needed in order to ensure that the chip is used in the most efficient and effective manner.
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| QTY | Unit Price | Ext Price |
|---|---|---|
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