AMD Xilinx
XC40250XV-09BG432I
XC40250XV-09BG432I ECAD Model
XC40250XV-09BG432I Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 2.5 V | |
| Number of Inputs | 448 | |
| Number of Outputs | 448 | |
| Number of Logic Cells | 8464 | |
| Number of Equivalent Gates | 180000 | |
| Number of CLBs | 8464 | |
| Combinatorial Delay of a CLB-Max | 1.3 ns | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 8464 CLBS, 180000 GATES | |
| Additional Feature | CAN ALSO USE 500000 GATES | |
| Clock Frequency-Max | 225 MHz | |
| Power Supplies | 2.5,3.3 V | |
| Supply Voltage-Max | 2.7 V | |
| Supply Voltage-Min | 2.3 V | |
| JESD-30 Code | S-PBGA-B432 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 3 | |
| Peak Reflow Temperature (Cel) | 225 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 432 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LBGA | |
| Package Equivalence Code | BGA432,31X31,50 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, LOW PROFILE | |
| Surface Mount | YES | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | BALL | |
| Terminal Pitch | 1.27 mm | |
| Terminal Position | BOTTOM | |
| Width | 40 mm | |
| Length | 40 mm | |
| Seated Height-Max | 1.7 mm | |
| Ihs Manufacturer | XILINX INC | |
| Reach Compliance Code | not_compliant | |
| HTS Code | 8542.39.00.01 | |
| Part Package Code | BGA | |
| Package Description | PLASTIC, BGA-432 | |
| Pin Count | 432 |
XC40250XV-09BG432I Datasheet Download
XC40250XV-09BG432I Overview
The chip model XC40250XV-09BG432I is a cutting-edge semiconductor product developed by Xilinx Corporation. It features an innovative architecture and high performance, making it a powerful solution for a wide range of applications. Its main advantages include low power consumption, high speed, and high integration. All these features make it an ideal choice for a variety of applications, such as high-end communication systems, intelligent robots, and other embedded systems.
The XC40250XV-09BG432I chip model is designed with the intention of providing users with a high-performance and low-power solution for their needs. This chip model is capable of providing a high degree of integration and scalability, allowing users to easily upgrade their systems with minimal effort. Furthermore, the chip model can be used to develop and deploy advanced communication systems, as well as to create intelligent robots.
The demand for the XC40250XV-09BG432I chip model is expected to increase in the future as more applications require high-performance and low-power solutions. This chip model is also expected to be used in the development and popularization of future intelligent robots, which will require a high level of technical expertise. To use the chip model effectively, users will need to have a solid understanding of computer architecture, digital signal processing, and embedded systems.
In conclusion, the XC40250XV-09BG432I chip model is an ideal solution for a wide range of applications, providing users with a high-performance and low-power solution. The chip model is expected to be in high demand in the future, as more applications require advanced communication systems and intelligent robots. To use the chip model effectively, users will need to have a solid understanding of computer architecture, digital signal processing, and embedded systems.
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| QTY | Unit Price | Ext Price |
|---|---|---|
| No reference price found. | ||