AMD Xilinx
XC40250XV-09BG432C
XC40250XV-09BG432C ECAD Model
XC40250XV-09BG432C Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 2.5 V | |
| Number of Inputs | 448 | |
| Number of Outputs | 448 | |
| Number of Logic Cells | 8464 | |
| Number of Equivalent Gates | 180000 | |
| Number of CLBs | 8464 | |
| Combinatorial Delay of a CLB-Max | 1.3 ns | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 8464 CLBS, 180000 GATES | |
| Additional Feature | CAN ALSO USE 500000 GATES | |
| Clock Frequency-Max | 225 MHz | |
| Power Supplies | 2.5,3.3 V | |
| Supply Voltage-Max | 2.7 V | |
| Supply Voltage-Min | 2.3 V | |
| JESD-30 Code | S-PBGA-B432 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | 225 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 432 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LBGA | |
| Package Equivalence Code | BGA432,31X31,50 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, LOW PROFILE | |
| Surface Mount | YES | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | BALL | |
| Terminal Pitch | 1.27 mm | |
| Terminal Position | BOTTOM | |
| Width | 40 mm | |
| Length | 40 mm | |
| Seated Height-Max | 1.7 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | PLASTIC, BGA-432 | |
| Pin Count | 432 | |
| Reach Compliance Code | not_compliant | |
| HTS Code | 8542.39.00.01 |
XC40250XV-09BG432C Datasheet Download
XC40250XV-09BG432C Overview
The XC40250XV-09BG432C chip model is a powerful device designed to support high-performance digital signal processing, embedded processing, and image processing applications. It is designed to be programmed using the Hardware Description Language (HDL). This chip model is well-suited for a range of applications, from consumer electronics to industrial automation.
The chip model XC40250XV-09BG432C is part of a larger trend in the industry towards more powerful and versatile chips. As technology advances, new features and capabilities are added to these chips, allowing for more complex and efficient applications. This chip model is no exception, as it provides a range of features and capabilities that make it an ideal choice for a variety of applications.
To ensure successful implementation of the XC40250XV-09BG432C chip model, it is important to understand the product description and design requirements. This includes understanding the architecture of the chip, the types of instructions it can execute, the memory requirements, and the power consumption. Additionally, it is important to understand the environmental factors that may affect the chip, such as temperature and humidity.
When designing applications for the XC40250XV-09BG432C chip model, it is important to consider the support of new technologies. This includes things like wireless connectivity, cloud computing, and artificial intelligence. Understanding the current trends in these technologies and how they can be integrated into the chip model is essential for successful implementation.
Case studies of successful implementations of the XC40250XV-09BG432C chip model can provide useful insight into the design process. Additionally, it is important to consider any potential risks associated with the chip model, as well as any precautions that need to be taken.
Overall, the XC40250XV-09BG432C chip model is a powerful device that can provide a range of features and capabilities for a variety of applications. Understanding the product description and design requirements, as well as the support of new technologies, is essential for successful implementation. Additionally, studying case studies and understanding potential risks and precautions is important for successful implementation of the chip model.
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|---|---|---|
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