AMD Xilinx
XC40250XV-08BG560I
XC40250XV-08BG560I ECAD Model
XC40250XV-08BG560I Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 2.5 V | |
| Number of Inputs | 448 | |
| Number of Outputs | 448 | |
| Number of Logic Cells | 8464 | |
| Number of Equivalent Gates | 180000 | |
| Number of CLBs | 8464 | |
| Combinatorial Delay of a CLB-Max | 1.1 ns | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 8464 CLBS, 180000 GATES | |
| Additional Feature | CAN ALSO USE 500000 GATES | |
| Clock Frequency-Max | 258 MHz | |
| Power Supplies | 2.5,3.3 V | |
| Supply Voltage-Max | 2.7 V | |
| Supply Voltage-Min | 2.3 V | |
| JESD-30 Code | S-PBGA-B560 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 3 | |
| Peak Reflow Temperature (Cel) | 225 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 560 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LBGA | |
| Package Equivalence Code | BGA560,33X33,50 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, LOW PROFILE | |
| Surface Mount | YES | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | BALL | |
| Terminal Pitch | 1.27 mm | |
| Terminal Position | BOTTOM | |
| Width | 42.5 mm | |
| Length | 42.5 mm | |
| Seated Height-Max | 1.7 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | PLASTIC, BGA-560 | |
| Pin Count | 560 | |
| Reach Compliance Code | not_compliant | |
| HTS Code | 8542.39.00.01 |
XC40250XV-08BG560I Datasheet Download
XC40250XV-08BG560I Overview
The chip model XC40250XV-08BG560I is a powerful and versatile device that has the potential to be applied to a variety of industries. It is designed to meet the needs of a variety of applications, from communications to robotics. The chip model is capable of providing high speed, low latency, and high-performance processing capabilities.
The industry trends of the chip model XC40250XV-08BG560I are constantly evolving in order to meet the needs of the ever-changing market. As technology advances, the need for more powerful and reliable chips will increase. This chip model is designed to meet these requirements, and its features make it suitable for a variety of applications.
The original design intention of the chip model XC40250XV-08BG560I is to provide a reliable and powerful solution for communication and robotics applications. The chip model is capable of providing high speed, low latency, and high-performance processing capabilities, which makes it suitable for a variety of applications. The chip model is also capable of providing support for new technologies, such as 5G, that are needed in order to meet the demands of the modern world.
The future development of related industries will depend on the specific technologies that are needed. The chip model XC40250XV-08BG560I is capable of providing the necessary support for these technologies, and it is also capable of being upgraded in order to meet the needs of the ever-changing market. In addition, the chip model is also capable of being applied to the development and popularization of future intelligent robots.
In order to effectively use the chip model XC40250XV-08BG560I, technical talents are needed who have the knowledge and experience to be able to utilize the chip model for its full potential. These technical talents must be able to understand the chip model, as well as be able to identify the needs of the application environment in order to provide the best possible solution.
In conclusion, the chip model XC40250XV-08BG560I is a powerful and versatile device that has the potential to be applied to a variety of industries. It is designed to meet the needs of a variety of applications, from communications to robotics. The chip model is capable of providing high speed, low latency, and high-performance processing capabilities, and is also capable of providing support for new technologies. The future development of related industries will depend on the specific technologies that are needed, and the chip model XC40250XV-08BG560I is capable of providing the necessary support for these technologies. In order to effectively use the chip model, technical talents are needed who have the knowledge and experience to be able to utilize the chip model for its full potential.
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Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| No reference price found. | ||