AMD Xilinx
XC40250XV-08BG560C
XC40250XV-08BG560C ECAD Model
XC40250XV-08BG560C Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 2.5 V | |
| Number of Inputs | 448 | |
| Number of Outputs | 448 | |
| Number of Logic Cells | 8464 | |
| Number of Equivalent Gates | 180000 | |
| Number of CLBs | 8464 | |
| Combinatorial Delay of a CLB-Max | 1.1 ns | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 8464 CLBS, 180000 GATES | |
| Additional Feature | CAN ALSO USE 500000 GATES | |
| Clock Frequency-Max | 258 MHz | |
| Power Supplies | 2.5,3.3 V | |
| Supply Voltage-Max | 2.7 V | |
| Supply Voltage-Min | 2.3 V | |
| JESD-30 Code | S-PBGA-B560 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | 225 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 560 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LBGA | |
| Package Equivalence Code | BGA560,33X33,50 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, LOW PROFILE | |
| Surface Mount | YES | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | BALL | |
| Terminal Pitch | 1.27 mm | |
| Terminal Position | BOTTOM | |
| Width | 42.5 mm | |
| Length | 42.5 mm | |
| Seated Height-Max | 1.7 mm | |
| Ihs Manufacturer | XILINX INC | |
| Reach Compliance Code | not_compliant | |
| HTS Code | 8542.39.00.01 | |
| Part Package Code | BGA | |
| Package Description | PLASTIC, BGA-560 | |
| Pin Count | 560 |
XC40250XV-08BG560C Datasheet Download
XC40250XV-08BG560C Overview
The chip model XC40250XV-08BG560C is a type of field-programmable gate array (FPGA) chip developed by Xilinx, a leader in the semiconductor industry. It is a high-performance, low-power programmable logic device that provides a wide range of functions, including digital signal processing, embedded processing, and general-purpose computing. It is designed to be used in a wide range of applications, including industrial automation, embedded systems, and high-performance computing.
The XC40250XV-08BG560C chip model has a wide range of features that make it suitable for a variety of applications. It is capable of running multiple algorithms simultaneously, and its low power consumption makes it ideal for use in battery-powered devices. Furthermore, its high-speed processing capabilities make it suitable for use in high-performance computing applications.
The industry trends of the XC40250XV-08BG560C chip model are very positive, as it is being used in a range of applications and industries. Its high-performance capabilities make it suitable for use in a variety of industries, including automotive, industrial automation, and medical. Furthermore, its low power consumption makes it suitable for use in battery-powered devices, such as wearables and medical implants.
The future development of the related industries that use the XC40250XV-08BG560C chip model will depend on what specific technologies are needed. For example, if the application environment requires the support of new technologies, such as artificial intelligence or machine learning, then the chip model will need to be designed to support these new technologies. Furthermore, the chip model will need to be designed to support the specific requirements of the application, such as speed, power consumption, and data throughput.
The XC40250XV-08BG560C chip model can also be used in the development and popularization of future intelligent robots. The chip model has the capability to support a wide range of algorithms, making it suitable for use in robotic applications. Furthermore, its low power consumption makes it suitable for use in battery-powered robots. However, in order to use the chip model effectively, it is important to have the right technical talents. This includes engineers and researchers with knowledge of artificial intelligence, machine learning, and robotics.
In conclusion, the XC40250XV-08BG560C chip model is a high-performance, low-power programmable logic device that is suitable for a wide range of applications. Its industry trends are very positive, and its future development will depend on what specific technologies are needed. Furthermore, the chip model can be used in the development and popularization of future intelligent robots, but it is important to have the right technical talents in order to use the chip model effectively.
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| QTY | Unit Price | Ext Price |
|---|---|---|
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