AMD Xilinx
XC40250XV-07BG560C
XC40250XV-07BG560C ECAD Model
XC40250XV-07BG560C Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 2.5 V | |
| Number of Inputs | 448 | |
| Number of Outputs | 448 | |
| Number of Logic Cells | 8464 | |
| Number of Equivalent Gates | 180000 | |
| Number of CLBs | 8464 | |
| Combinatorial Delay of a CLB-Max | 1 ns | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 8464 CLBS, 180000 GATES | |
| Additional Feature | CAN ALSO USE 500000 GATES | |
| Clock Frequency-Max | 296 MHz | |
| Power Supplies | 2.5,3.3 V | |
| Supply Voltage-Max | 2.7 V | |
| Supply Voltage-Min | 2.3 V | |
| JESD-30 Code | S-PBGA-B560 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | 225 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 560 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LBGA | |
| Package Equivalence Code | BGA560,33X33,50 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, LOW PROFILE | |
| Surface Mount | YES | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | BALL | |
| Terminal Pitch | 1.27 mm | |
| Terminal Position | BOTTOM | |
| Width | 42.5 mm | |
| Length | 42.5 mm | |
| Seated Height-Max | 1.7 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | PLASTIC, BGA-560 | |
| Pin Count | 560 | |
| Reach Compliance Code | not_compliant | |
| HTS Code | 8542.39.00.01 |
XC40250XV-07BG560C Datasheet Download
XC40250XV-07BG560C Overview
The chip model XC40250XV-07BG560C is a highly advanced piece of technology that is designed to meet the needs of modern networks and intelligent systems. It is designed to provide the necessary support for faster speeds, increased security, and better performance. The chip model is also designed to be compatible with a wide range of technologies, making it suitable for different applications.
The chip model XC40250XV-07BG560C is designed to meet the needs of modern networks and intelligent systems. It is designed to provide the necessary support for faster speeds, increased security, and better performance. It is also designed to be compatible with a wide range of technologies, making it suitable for different applications.
In terms of industry trends, the chip model XC40250XV-07BG560C is expected to be used more and more in the future. This is due to the fact that it is designed to meet the needs of modern networks and intelligent systems. It is also designed to be compatible with a wide range of technologies, making it suitable for different applications.
The product description of the chip model XC40250XV-07BG560C is as follows: it is designed to provide the necessary support for faster speeds, increased security, and better performance. It is also designed to be compatible with a wide range of technologies, making it suitable for different applications.
In terms of actual case studies, the chip model XC40250XV-07BG560C has been successfully used in numerous projects. These projects include networks, intelligent systems, and other applications. The chip model has been found to be reliable and efficient in these projects.
In terms of precautions, it is important to note that the chip model XC40250XV-07BG560C is designed to be used in specific applications. It is important to ensure that the chip model is compatible with the application before using it. It is also important to ensure that the chip model is compatible with the application environment and that it meets the necessary requirements.
Overall, the chip model XC40250XV-07BG560C is a highly advanced piece of technology that is designed to meet the needs of modern networks and intelligent systems. It is designed to provide the necessary support for faster speeds, increased security, and better performance. It is also designed to be compatible with a wide range of technologies, making it suitable for different applications. With its reliable performance and efficient design, the chip model is expected to be used more and more in the future.
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Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| No reference price found. | ||