
AMD Xilinx
XC4020XLA-09PQG160C
XC4020XLA-09PQG160C ECAD Model
XC4020XLA-09PQG160C Attributes
Type | Description | Select |
---|---|---|
Rohs Code | Yes | |
Part Life Cycle Code | Obsolete | |
Supply Voltage-Nom | 3.3 V | |
Number of Equivalent Gates | 13000 | |
Number of CLBs | 784 | |
Combinatorial Delay of a CLB-Max | 1.1 ns | |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
Temperature Grade | OTHER | |
Package Shape | SQUARE | |
Technology | CMOS | |
Organization | 784 CLBS, 13000 GATES | |
Additional Feature | CAN ALSO USE 40000 GATES | |
Clock Frequency-Max | 227 MHz | |
Supply Voltage-Max | 3.6 V | |
Supply Voltage-Min | 3 V | |
JESD-30 Code | S-PQFP-G160 | |
Qualification Status | Not Qualified | |
JESD-609 Code | e3 | |
Moisture Sensitivity Level | 3 | |
Operating Temperature-Max | 85 °C | |
Peak Reflow Temperature (Cel) | 245 | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Number of Terminals | 160 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | QFP | |
Package Shape | SQUARE | |
Package Style | FLATPACK | |
Surface Mount | YES | |
Terminal Finish | MATTE TIN | |
Terminal Form | GULL WING | |
Terminal Pitch | 650 µm | |
Terminal Position | QUAD | |
Width | 28 mm | |
Length | 28 mm | |
Seated Height-Max | 4.1 mm | |
Ihs Manufacturer | XILINX INC | |
Part Package Code | QFP | |
Package Description | QFP, | |
Pin Count | 160 | |
Reach Compliance Code | compliant | |
HTS Code | 8542.39.00.01 |
XC4020XLA-09PQG160C Datasheet Download
XC4020XLA-09PQG160C Overview
The XC4020XLA-09PQG160C chip model is an advanced, high-performance integrated circuit designed for use in a variety of applications. It is a low-power, high-performance, low-cost solution for a wide range of applications, including automotive, consumer electronics, industrial, medical, and other embedded systems. The chip model has been designed to provide a high level of integration, allowing for reduced overall system costs and improved performance.
The XC4020XLA-09PQG160C chip model provides several advantages, including a low power consumption, low cost, and high performance. It is capable of operating at a wide range of frequencies, from low-frequency to high-frequency, allowing for a wide range of applications. The chip also offers a wide range of features, including a wide range of memory and peripheral interfaces, as well as a wide range of power management functions. Additionally, the chip model is designed to be highly reliable and robust, making it suitable for use in a variety of applications.
The XC4020XLA-09PQG160C chip model is expected to experience increasing demand in the future, as it is a cost-effective solution for a wide range of applications. It is expected to be used in automotive, consumer electronics, industrial, medical, and other embedded systems, and is likely to become a popular choice for many applications. Additionally, the chip model is expected to be used in advanced communication systems, as it is capable of operating at a wide range of frequencies and has a wide range of features.
The XC4020XLA-09PQG160C chip model is designed to meet the specific design requirements of a variety of applications. It has a wide range of features, including a wide range of memory and peripheral interfaces, as well as a wide range of power management functions. Additionally, the chip model is designed to be highly reliable and robust, making it suitable for use in a variety of applications.
The XC4020XLA-09PQG160C chip model has been used in several case studies and has been found to be reliable and robust. In addition, the chip model has been found to be cost-effective, with a low power consumption and a low cost. However, it is important to note that the chip model may not be suitable for all applications, and it is important to consider the specific design requirements of the application when selecting a chip model. Additionally, it is important to consider the possibility of future upgrades, as the chip model may not be able to support new features or technologies.
In conclusion, the XC4020XLA-09PQG160C chip model is a cost-effective, low-power, high-performance, low-cost solution for a wide range of applications. The chip model has a wide range of features, including a wide range of memory and peripheral interfaces, as well as a wide range of power management functions. Additionally, the chip model is designed to be highly reliable and robust, making it suitable for use in a variety of applications. The chip model is expected to experience increasing demand in the future, as it is a cost-effective solution for a wide range of applications. However, it is important to consider the specific design requirements of the application when selecting a chip model, as well as the possibility of future upgrades.
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5,558 In Stock






Pricing (USD)
QTY | Unit Price | Ext Price |
---|---|---|
1+ | $6.3984 | $6.3984 |
10+ | $6.3296 | $63.2960 |
100+ | $5.9856 | $598.5600 |
1000+ | $5.6416 | $2,820.8000 |
10000+ | $5.1600 | $5,160.0000 |
The price is for reference only, please refer to the actual quotation! |