
AMD Xilinx
XC40200XV-09BG560C
XC40200XV-09BG560C ECAD Model
XC40200XV-09BG560C Attributes
Type | Description | Select |
---|---|---|
Rohs Code | No | |
Part Life Cycle Code | Obsolete | |
Supply Voltage-Nom | 2.5 V | |
Number of Inputs | 448 | |
Number of Outputs | 448 | |
Number of Logic Cells | 7056 | |
Number of Equivalent Gates | 130000 | |
Number of CLBs | 7056 | |
Combinatorial Delay of a CLB-Max | 1.3 ns | |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
Temperature Grade | OTHER | |
Package Shape | SQUARE | |
Technology | CMOS | |
Organization | 7056 CLBS, 130000 GATES | |
Additional Feature | CAN ALSO USE 400000 GATES | |
Clock Frequency-Max | 225 MHz | |
Power Supplies | 2.5,3.3 V | |
Supply Voltage-Max | 2.7 V | |
Supply Voltage-Min | 2.3 V | |
JESD-30 Code | S-PBGA-B560 | |
Qualification Status | Not Qualified | |
JESD-609 Code | e0 | |
Moisture Sensitivity Level | 3 | |
Operating Temperature-Max | 85 °C | |
Peak Reflow Temperature (Cel) | 225 | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Number of Terminals | 560 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | LBGA | |
Package Equivalence Code | BGA560,33X33,50 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY, LOW PROFILE | |
Surface Mount | YES | |
Terminal Finish | TIN LEAD | |
Terminal Form | BALL | |
Terminal Pitch | 1.27 mm | |
Terminal Position | BOTTOM | |
Width | 42.5 mm | |
Length | 42.5 mm | |
Seated Height-Max | 1.7 mm | |
Ihs Manufacturer | XILINX INC | |
Part Package Code | BGA | |
Package Description | PLASTIC, BGA-560 | |
Pin Count | 560 | |
Reach Compliance Code | not_compliant | |
HTS Code | 8542.39.00.01 |
XC40200XV-09BG560C Datasheet Download
XC40200XV-09BG560C Overview
The XC40200XV-09BG560C chip model is a state-of-the-art integrated circuit (IC) developed by Xilinx, Inc. It is designed to provide a high-performance, low-power FPGA solution for a range of applications. This chip model is ideal for a variety of applications, including data processing, communication systems, and embedded systems.
The XC40200XV-09BG560C chip model provides a great deal of flexibility and scalability, allowing it to be used in a wide range of applications. It is capable of supporting multiple clock frequencies, which makes it suitable for a variety of communication systems, including high-speed networks. It also has a wide range of programmable logic blocks, allowing it to be used for data processing tasks. Furthermore, it has a low power consumption and is highly reliable, making it a great choice for embedded systems.
The XC40200XV-09BG560C chip model is expected to experience a great deal of demand in the near future. As the demand for high-performance and low-power solutions increases, this chip model will become increasingly popular. Additionally, its flexibility and scalability make it suitable for a variety of applications, so it is likely to be used in a wide range of industries.
The original design intention of the XC40200XV-09BG560C chip model was to provide a reliable, low-power solution for data processing, communication systems, and embedded systems. It is capable of supporting multiple clock frequencies, allowing it to be used in high-speed networks. It also has a wide range of programmable logic blocks, making it suitable for a variety of data processing tasks. In addition, its low power consumption and high reliability make it an ideal choice for embedded applications.
In terms of future upgrades, the XC40200XV-09BG560C chip model is capable of being upgraded with new technologies. This could include better clock frequencies, more programmable logic blocks, and higher clock speeds. Additionally, its low power consumption and high reliability make it suitable for advanced communication systems. As the demand for high-performance and low-power solutions increases, this chip model is likely to be upgraded with new technologies in order to meet the needs of these applications.
In conclusion, the XC40200XV-09BG560C chip model is a high-performance, low-power FPGA solution designed to meet the needs of a variety of applications. It is expected to experience a great deal of demand in the near future, and it is capable of being upgraded with new technologies in order to meet the needs of advanced communication systems. As the demand for high-performance and low-power solutions increases, this chip model is likely to become increasingly popular.
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