XC40200XV-09BG560C
XC40200XV-09BG560C
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rohs

AMD Xilinx

XC40200XV-09BG560C


XC40200XV-09BG560C
F20-XC40200XV-09BG560C
Active
FIELD PROGRAMMABLE GATE ARRAY, CMOS, PLASTIC, BGA-560
PLASTIC, BGA-560

XC40200XV-09BG560C ECAD Model


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XC40200XV-09BG560C Attributes


Type Description Select
Rohs Code No
Part Life Cycle Code Obsolete
Supply Voltage-Nom 2.5 V
Number of Inputs 448
Number of Outputs 448
Number of Logic Cells 7056
Number of Equivalent Gates 130000
Number of CLBs 7056
Combinatorial Delay of a CLB-Max 1.3 ns
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Temperature Grade OTHER
Package Shape SQUARE
Technology CMOS
Organization 7056 CLBS, 130000 GATES
Additional Feature CAN ALSO USE 400000 GATES
Clock Frequency-Max 225 MHz
Power Supplies 2.5,3.3 V
Supply Voltage-Max 2.7 V
Supply Voltage-Min 2.3 V
JESD-30 Code S-PBGA-B560
Qualification Status Not Qualified
JESD-609 Code e0
Moisture Sensitivity Level 3
Operating Temperature-Max 85 °C
Peak Reflow Temperature (Cel) 225
Time@Peak Reflow Temperature-Max (s) 30
Number of Terminals 560
Package Body Material PLASTIC/EPOXY
Package Code LBGA
Package Equivalence Code BGA560,33X33,50
Package Shape SQUARE
Package Style GRID ARRAY, LOW PROFILE
Surface Mount YES
Terminal Finish TIN LEAD
Terminal Form BALL
Terminal Pitch 1.27 mm
Terminal Position BOTTOM
Width 42.5 mm
Length 42.5 mm
Seated Height-Max 1.7 mm
Ihs Manufacturer XILINX INC
Part Package Code BGA
Package Description PLASTIC, BGA-560
Pin Count 560
Reach Compliance Code not_compliant
HTS Code 8542.39.00.01

XC40200XV-09BG560C Datasheet Download


XC40200XV-09BG560C Overview



The XC40200XV-09BG560C chip model is a state-of-the-art integrated circuit (IC) developed by Xilinx, Inc. It is designed to provide a high-performance, low-power FPGA solution for a range of applications. This chip model is ideal for a variety of applications, including data processing, communication systems, and embedded systems.


The XC40200XV-09BG560C chip model provides a great deal of flexibility and scalability, allowing it to be used in a wide range of applications. It is capable of supporting multiple clock frequencies, which makes it suitable for a variety of communication systems, including high-speed networks. It also has a wide range of programmable logic blocks, allowing it to be used for data processing tasks. Furthermore, it has a low power consumption and is highly reliable, making it a great choice for embedded systems.


The XC40200XV-09BG560C chip model is expected to experience a great deal of demand in the near future. As the demand for high-performance and low-power solutions increases, this chip model will become increasingly popular. Additionally, its flexibility and scalability make it suitable for a variety of applications, so it is likely to be used in a wide range of industries.


The original design intention of the XC40200XV-09BG560C chip model was to provide a reliable, low-power solution for data processing, communication systems, and embedded systems. It is capable of supporting multiple clock frequencies, allowing it to be used in high-speed networks. It also has a wide range of programmable logic blocks, making it suitable for a variety of data processing tasks. In addition, its low power consumption and high reliability make it an ideal choice for embedded applications.


In terms of future upgrades, the XC40200XV-09BG560C chip model is capable of being upgraded with new technologies. This could include better clock frequencies, more programmable logic blocks, and higher clock speeds. Additionally, its low power consumption and high reliability make it suitable for advanced communication systems. As the demand for high-performance and low-power solutions increases, this chip model is likely to be upgraded with new technologies in order to meet the needs of these applications.


In conclusion, the XC40200XV-09BG560C chip model is a high-performance, low-power FPGA solution designed to meet the needs of a variety of applications. It is expected to experience a great deal of demand in the near future, and it is capable of being upgraded with new technologies in order to meet the needs of advanced communication systems. As the demand for high-performance and low-power solutions increases, this chip model is likely to become increasingly popular.



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