AMD Xilinx
XC40200XV-08BG560C
XC40200XV-08BG560C ECAD Model
XC40200XV-08BG560C Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 2.5 V | |
| Number of Inputs | 448 | |
| Number of Outputs | 448 | |
| Number of Logic Cells | 7056 | |
| Number of Equivalent Gates | 130000 | |
| Number of CLBs | 7056 | |
| Combinatorial Delay of a CLB-Max | 1.1 ns | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 7056 CLBS, 130000 GATES | |
| Additional Feature | CAN ALSO USE 400000 GATES | |
| Clock Frequency-Max | 258 MHz | |
| Power Supplies | 2.5,3.3 V | |
| Supply Voltage-Max | 2.7 V | |
| Supply Voltage-Min | 2.3 V | |
| JESD-30 Code | S-PBGA-B560 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | 225 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 560 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LBGA | |
| Package Equivalence Code | BGA560,33X33,50 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, LOW PROFILE | |
| Surface Mount | YES | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | BALL | |
| Terminal Pitch | 1.27 mm | |
| Terminal Position | BOTTOM | |
| Width | 42.5 mm | |
| Length | 42.5 mm | |
| Seated Height-Max | 1.7 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | PLASTIC, BGA-560 | |
| Pin Count | 560 | |
| Reach Compliance Code | not_compliant | |
| HTS Code | 8542.39.00.01 |
XC40200XV-08BG560C Datasheet Download
XC40200XV-08BG560C Overview
The chip model XC40200XV-08BG560C is a high-performance digital signal processor designed for embedded processing, image processing, and other applications. It is based on the Xilinx Virtex-5 FPGA technology and requires the use of HDL language for programming. With its advanced features and high-speed performance, the XC40200XV-08BG560C chip is suitable for a wide range of applications.
In terms of industry trends, the XC40200XV-08BG560C chip is an excellent choice for applications that require high-performance digital signal processing. The chip is designed to be compatible with various existing technologies, making it suitable for a wide range of applications. As technology advances, the XC40200XV-08BG560C chip can be adapted to new technologies, making it a reliable choice for future development.
In terms of product description, the XC40200XV-08BG560C chip is a high-performance digital signal processor with a wide range of features. It is based on the Xilinx Virtex-5 FPGA technology and requires the use of HDL language for programming. The chip is designed to be compatible with existing technologies and is suitable for a wide range of applications.
In terms of design requirements, the XC40200XV-08BG560C chip is designed to be compatible with existing technologies. The chip is also designed to be able to adapt to new technologies, making it suitable for future development. Additionally, the chip is designed to be able to process digital signals at high speeds, making it suitable for a wide range of applications.
In terms of actual case studies, there are numerous case studies available that demonstrate the effectiveness of the XC40200XV-08BG560C chip. These case studies demonstrate the chip's ability to process digital signals at high speeds, as well as its compatibility with existing technologies.
In terms of precautions, the XC40200XV-08BG560C chip should be used in accordance with the manufacturer's instructions. Additionally, the chip should be handled with care and should not be exposed to extreme temperatures or moisture.
Overall, the XC40200XV-08BG560C chip is an excellent choice for applications that require high-performance digital signal processing. The chip is designed to be compatible with existing technologies and is suitable for a wide range of applications. Additionally, the chip is designed to be able to adapt to new technologies, making it a reliable choice for future development.
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| QTY | Unit Price | Ext Price |
|---|---|---|
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