
AMD Xilinx
XC40150XV-09PG559C
XC40150XV-09PG559C ECAD Model
XC40150XV-09PG559C Attributes
Type | Description | Select |
---|---|---|
Rohs Code | Yes | |
Part Life Cycle Code | Obsolete | |
Supply Voltage-Nom | 2.5 V | |
Number of Inputs | 448 | |
Number of Outputs | 448 | |
Number of Logic Cells | 5184 | |
Number of Equivalent Gates | 100000 | |
Number of CLBs | 5184 | |
Combinatorial Delay of a CLB-Max | 1.3 ns | |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
Temperature Grade | OTHER | |
Package Shape | SQUARE | |
Technology | CMOS | |
Organization | 5184 CLBS, 100000 GATES | |
Additional Feature | CAN ALSO USE 300000 GATES | |
Clock Frequency-Max | 225 MHz | |
Power Supplies | 2.5,3.3 V | |
Supply Voltage-Max | 2.7 V | |
Supply Voltage-Min | 2.3 V | |
JESD-30 Code | S-CPGA-P559 | |
Qualification Status | Not Qualified | |
Operating Temperature-Max | 85 °C | |
Number of Terminals | 559 | |
Package Body Material | CERAMIC, METAL-SEALED COFIRED | |
Package Code | HIPGA | |
Package Equivalence Code | HSPGA559,43X43 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY, HEAT SINK/SLUG, INTERSTITIAL PITCH | |
Surface Mount | NO | |
Terminal Form | PIN/PEG | |
Terminal Pitch | 2.54 mm | |
Terminal Position | PERPENDICULAR | |
Width | 57.404 mm | |
Length | 57.404 mm | |
Seated Height-Max | 5.969 mm | |
Ihs Manufacturer | XILINX INC | |
Part Package Code | PGA | |
Package Description | HIPGA, HSPGA559,43X43 | |
Pin Count | 559 | |
Reach Compliance Code | unknown | |
HTS Code | 8542.39.00.01 |
XC40150XV-09PG559C Datasheet Download
XC40150XV-09PG559C Overview
The XC40150XV-09PG559C chip model is a high-end integrated circuit designed for advanced industrial applications. It is the latest model in the XC40150 series, and it is designed to provide optimal performance in a wide range of applications. It is a state-of-the-art integrated circuit that is capable of delivering higher performance than its predecessors in a wide variety of industrial applications.
The XC40150XV-09PG559C chip model offers many advantages over traditional integrated circuits. It has a wide range of operating frequencies, allowing it to be used in a variety of applications. It also has a low power consumption, meaning it can be used in applications that require low power consumption. Additionally, it is highly reliable, meaning it can be used in applications that require long-term reliability.
The XC40150XV-09PG559C chip model is designed to meet the needs of a wide range of industries. It can be used in automotive, medical, industrial, and consumer electronics applications. Its design makes it suitable for a wide range of applications, from high-end industrial applications to consumer electronics.
The demand for the XC40150XV-09PG559C chip model is expected to continue to increase in the future due to its wide range of applications and its high performance. As the world becomes increasingly connected, the demand for more powerful integrated circuits will continue to grow. This is especially true in the automotive industry, where the demand for higher performance integrated circuits is expected to grow significantly in the near future.
The XC40150XV-09PG559C chip model is also suitable for the development and popularization of future intelligent robots. The chip model is capable of providing the necessary computing power for the development of advanced robot applications. Additionally, the chip model is capable of providing the necessary power for the development of advanced robotics applications.
To use the XC40150XV-09PG559C chip model effectively, it is important to understand its design requirements and case studies. It is also important to understand the precautions that need to be taken when using the chip model. For example, the chip model should not be used in an environment with high temperatures, as it may cause the chip model to malfunction. Additionally, the chip model should not be used in an environment with high levels of moisture, as this may cause the chip model to malfunction.
In conclusion, the XC40150XV-09PG559C chip model is a high-end integrated circuit that is suitable for a wide range of applications. It is expected to be in high demand in the future due to its wide range of applications and its high performance. Additionally, the chip model is suitable for the development and popularization of future intelligent robots. To use the chip model effectively, it is important to understand its design requirements and case studies, as well as the precautions that need to be taken when using the chip model.
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