AMD Xilinx
XC40150XV-09BG560I
XC40150XV-09BG560I ECAD Model
XC40150XV-09BG560I Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 2.5 V | |
| Number of Inputs | 448 | |
| Number of Outputs | 448 | |
| Number of Logic Cells | 5184 | |
| Number of Equivalent Gates | 100000 | |
| Number of CLBs | 5184 | |
| Combinatorial Delay of a CLB-Max | 1.3 ns | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 5184 CLBS, 100000 GATES | |
| Additional Feature | CAN ALSO USE 300000 GATES | |
| Clock Frequency-Max | 225 MHz | |
| Power Supplies | 2.5,3.3 V | |
| Supply Voltage-Max | 2.7 V | |
| Supply Voltage-Min | 2.3 V | |
| JESD-30 Code | S-PBGA-B560 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 3 | |
| Peak Reflow Temperature (Cel) | 225 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 560 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LBGA | |
| Package Equivalence Code | BGA560,33X33,50 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, LOW PROFILE | |
| Surface Mount | YES | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | BALL | |
| Terminal Pitch | 1.27 mm | |
| Terminal Position | BOTTOM | |
| Width | 42.5 mm | |
| Length | 42.5 mm | |
| Seated Height-Max | 1.7 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | PLASTIC, BGA-560 | |
| Pin Count | 560 | |
| Reach Compliance Code | not_compliant | |
| HTS Code | 8542.39.00.01 |
XC40150XV-09BG560I Datasheet Download
XC40150XV-09BG560I Overview
The XC40150XV-09BG560I chip model is a powerful and versatile digital signal processor that has a wide range of applications. It is suitable for high-performance digital signal processing, embedded processing, image processing, and other related tasks. The chip model is designed to be programmed in HDL (Hardware Description Language) and offers a number of advantages, such as low power consumption, high performance, and scalability.
The chip model is expected to be increasingly in demand in the coming years, as the development of digital signal processing and embedded processing technologies continues to progress. With its low power consumption and high performance, the chip model is likely to be used in a variety of scenarios, such as in medical imaging, robotics, and autonomous vehicles. Additionally, the chip model is likely to be used in network applications and intelligent scenarios, such as in the Internet of Things (IoT).
The chip model is also likely to be used in the era of fully intelligent systems. It is capable of performing complex tasks quickly and accurately, and can be used to power advanced artificial intelligence (AI) systems. The chip model is expected to be used in a variety of applications, including autonomous vehicles, robotics, and intelligent home systems. It is also likely to be used in industrial automation and other related applications.
Overall, the XC40150XV-09BG560I chip model is a powerful and versatile digital signal processor that is expected to be increasingly in demand in the coming years. It is suitable for high-performance digital signal processing, embedded processing, image processing, and other related tasks. It is also likely to be used in a variety of applications, including in networks, intelligent scenarios, and fully intelligent systems.
You May Also Be Interested In
5,380 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| No reference price found. | ||