AMD Xilinx
XC40150XV-09BG560C
XC40150XV-09BG560C ECAD Model
XC40150XV-09BG560C Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 2.5 V | |
| Number of Inputs | 448 | |
| Number of Outputs | 448 | |
| Number of Logic Cells | 5184 | |
| Number of Equivalent Gates | 100000 | |
| Number of CLBs | 5184 | |
| Combinatorial Delay of a CLB-Max | 1.3 ns | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 5184 CLBS, 100000 GATES | |
| Additional Feature | CAN ALSO USE 300000 GATES | |
| Clock Frequency-Max | 225 MHz | |
| Power Supplies | 2.5,3.3 V | |
| Supply Voltage-Max | 2.7 V | |
| Supply Voltage-Min | 2.3 V | |
| JESD-30 Code | S-PBGA-B560 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | 225 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 560 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LBGA | |
| Package Equivalence Code | BGA560,33X33,50 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, LOW PROFILE | |
| Surface Mount | YES | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | BALL | |
| Terminal Pitch | 1.27 mm | |
| Terminal Position | BOTTOM | |
| Width | 42.5 mm | |
| Length | 42.5 mm | |
| Seated Height-Max | 1.7 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | PLASTIC, BGA-560 | |
| Pin Count | 560 | |
| Reach Compliance Code | not_compliant | |
| HTS Code | 8542.39.00.01 |
XC40150XV-09BG560C Datasheet Download
XC40150XV-09BG560C Overview
The XC40150XV-09BG560C chip model is a high-performance chip developed by Xilinx, Inc., a leading provider of programmable logic solutions. It is designed to provide a cost-effective solution for customers who require a system-on-chip (SoC) solution with high performance, low power consumption, and a wide range of features. This model is expected to be in high demand in the coming years due to its various advantages.
The XC40150XV-09BG560C chip model is built on the Xilinx Virtex-5 family of FPGAs and offers a range of features that make it suitable for a wide range of applications. It has a high-speed, multi-gigabit transceiver, which enables it to be used in high-speed, high-bandwidth communication systems. It also features a high-performance, low-power processor core, which makes it suitable for embedded applications. Furthermore, it has integrated memory controllers and a number of other features that make it suitable for a variety of applications.
The XC40150XV-09BG560C chip model is designed to be upgradeable, allowing customers to upgrade their systems to the latest version of the chip model. This makes it suitable for use in advanced communication systems, as well as in networks that require high-speed, low-power, and low-cost solutions. It is also possible to use the chip model in the era of fully intelligent systems, as it is capable of supporting various intelligent scenarios.
In the future, the XC40150XV-09BG560C chip model is expected to be used in a variety of industries, such as automotive, industrial, medical, and consumer applications. It is also expected to be used in networks and intelligent systems, such as those used in the Internet of Things (IoT). As the chip model is designed to be upgradeable, it is possible to use it in the future to support more advanced applications and intelligent scenarios.
In conclusion, the XC40150XV-09BG560C chip model is a powerful and versatile chip model that is expected to be in high demand in the coming years. It is designed to provide a cost-effective solution for customers who require a system-on-chip (SoC) solution with high performance, low power consumption, and a wide range of features. It is also upgradeable, making it suitable for use in advanced communication systems, networks, and intelligent systems. As such, it is expected to be used in a variety of industries in the near future.
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2,667 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $483.6000 | $483.6000 |
| 10+ | $478.4000 | $4,784.0000 |
| 100+ | $452.4000 | $45,240.0000 |
| 1000+ | $426.4000 | $213,200.0000 |
| 10000+ | $390.0000 | $390,000.0000 |
| The price is for reference only, please refer to the actual quotation! | ||