AMD Xilinx
XC40150XV-09BG432I
XC40150XV-09BG432I ECAD Model
XC40150XV-09BG432I Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 2.5 V | |
| Number of Inputs | 448 | |
| Number of Outputs | 448 | |
| Number of Logic Cells | 5184 | |
| Number of Equivalent Gates | 100000 | |
| Number of CLBs | 5184 | |
| Combinatorial Delay of a CLB-Max | 1.3 ns | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 5184 CLBS, 100000 GATES | |
| Additional Feature | CAN ALSO USE 300000 GATES | |
| Clock Frequency-Max | 225 MHz | |
| Power Supplies | 2.5,3.3 V | |
| Supply Voltage-Max | 2.7 V | |
| Supply Voltage-Min | 2.3 V | |
| JESD-30 Code | S-PBGA-B432 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 3 | |
| Peak Reflow Temperature (Cel) | 225 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 432 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LBGA | |
| Package Equivalence Code | BGA432,31X31,50 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, LOW PROFILE | |
| Surface Mount | YES | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | BALL | |
| Terminal Pitch | 1.27 mm | |
| Terminal Position | BOTTOM | |
| Width | 40 mm | |
| Length | 40 mm | |
| Seated Height-Max | 1.7 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | PLASTIC, BGA-432 | |
| Pin Count | 432 | |
| Reach Compliance Code | not_compliant | |
| HTS Code | 8542.39.00.01 |
XC40150XV-09BG432I Datasheet Download
XC40150XV-09BG432I Overview
The chip model XC40150XV-09BG432I is a high-performance, low-power, low-cost and highly integrated integrated circuit (IC) designed to meet the needs of communication systems. It is equipped with a variety of features, such as high speed data processing, low power consumption, and a wide range of applications. Its original design intention was to provide a reliable and efficient solution for communication systems.
The XC40150XV-09BG432I is capable of providing high-speed data processing, low power consumption, and a wide range of applications. It can be used in advanced communication systems, such as 5G, Wi-Fi, Bluetooth, and other wireless communication networks. It is also suitable for intelligent scenarios, such as industrial automation, intelligent transportation, and smart home systems. Furthermore, this chip can be applied in the era of fully intelligent systems, such as the Internet of Things (IoT) and Artificial Intelligence (AI).
In order to meet the specific design requirements of the chip model XC40150XV-09BG432I, its features and functions should be carefully evaluated and tested. The chip should be able to process data accurately and quickly, while consuming minimal power. It should also be able to support the various applications and scenarios mentioned above. In addition, actual case studies should be conducted to determine the chip's performance in different environments and scenarios. Furthermore, precautions should be taken to ensure that the chip is not exposed to any potential risks or threats.
The chip model XC40150XV-09BG432I is a powerful and versatile chip that can be used in a variety of communication systems and intelligent scenarios. It is capable of providing high-speed data processing, low power consumption, and a wide range of applications. It can also be used in the era of fully intelligent systems, such as the Internet of Things (IoT) and Artificial Intelligence (AI). In order to ensure its performance and reliability, the chip should be carefully evaluated and tested according to its specific design requirements, with actual case studies and precautions taken into consideration.
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| QTY | Unit Price | Ext Price |
|---|---|---|
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