AMD Xilinx
XC40150XV-09BG432C
XC40150XV-09BG432C ECAD Model
XC40150XV-09BG432C Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 2.5 V | |
| Number of Inputs | 448 | |
| Number of Outputs | 448 | |
| Number of Logic Cells | 5184 | |
| Number of Equivalent Gates | 100000 | |
| Number of CLBs | 5184 | |
| Combinatorial Delay of a CLB-Max | 1.3 ns | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 5184 CLBS, 100000 GATES | |
| Additional Feature | CAN ALSO USE 300000 GATES | |
| Clock Frequency-Max | 225 MHz | |
| Power Supplies | 2.5,3.3 V | |
| Supply Voltage-Max | 2.7 V | |
| Supply Voltage-Min | 2.3 V | |
| JESD-30 Code | S-PBGA-B432 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | 225 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 432 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LBGA | |
| Package Equivalence Code | BGA432,31X31,50 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, LOW PROFILE | |
| Surface Mount | YES | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | BALL | |
| Terminal Pitch | 1.27 mm | |
| Terminal Position | BOTTOM | |
| Width | 40 mm | |
| Length | 40 mm | |
| Seated Height-Max | 1.7 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | PLASTIC, BGA-432 | |
| Pin Count | 432 | |
| Reach Compliance Code | not_compliant | |
| HTS Code | 8542.39.00.01 |
XC40150XV-09BG432C Datasheet Download
XC40150XV-09BG432C Overview
The chip model XC40150XV-09BG432C is a new generation of intelligent system integrated circuit, developed to meet the requirements of the ever-evolving digital world. It is a highly integrated chip, with a variety of embedded functions, and is designed to be used in networks and other intelligent scenarios. With its powerful computing capabilities, it can be used to develop and popularize future intelligent robots, and help to create a fully intelligent system.
The XC40150XV-09BG432C chip model is equipped with a variety of features, such as an integrated memory, an embedded processor, and a high-speed data transfer interface. It is designed to support a wide range of applications, including machine learning, artificial intelligence, and robotics. It is also designed to be flexible and customizable, allowing developers to tailor the chip to their specific needs.
In order to use the XC40150XV-09BG432C chip model effectively, certain technical skills are required. These include knowledge of digital signal processing, programming, and circuit design. Additionally, knowledge of the specific design requirements of the chip model is also necessary.
When using the XC40150XV-09BG432C chip model, it is important to consider the safety and security of the device. The chip model should be tested thoroughly before being used in any application, and any potential risks should be identified and addressed. Additionally, the chip model should be used in accordance with the manufacturer’s instructions, and any modifications should be done with caution.
The XC40150XV-09BG432C chip model has the potential to revolutionize the future of intelligent systems. It can be used to develop and popularize future intelligent robots, and help to create a fully intelligent system. With its powerful computing capabilities and its flexibility and customizability, it is sure to be an invaluable tool for developers and engineers in the coming years.
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Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| No reference price found. | ||