AMD Xilinx
XC40150XV-09BG352I
XC40150XV-09BG352I ECAD Model
XC40150XV-09BG352I Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 2.5 V | |
| Number of Inputs | 448 | |
| Number of Outputs | 448 | |
| Number of Logic Cells | 5184 | |
| Number of Equivalent Gates | 100000 | |
| Number of CLBs | 5184 | |
| Combinatorial Delay of a CLB-Max | 1.3 ns | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 5184 CLBS, 100000 GATES | |
| Additional Feature | CAN ALSO USE 300000 GATES | |
| Clock Frequency-Max | 225 MHz | |
| Power Supplies | 2.5,3.3 V | |
| Supply Voltage-Max | 2.7 V | |
| Supply Voltage-Min | 2.3 V | |
| JESD-30 Code | S-PBGA-B352 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 3 | |
| Peak Reflow Temperature (Cel) | 225 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 352 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LBGA | |
| Package Equivalence Code | BGA352,26X26,50 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, LOW PROFILE | |
| Surface Mount | YES | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | BALL | |
| Terminal Pitch | 1.27 mm | |
| Terminal Position | BOTTOM | |
| Width | 35 mm | |
| Length | 35 mm | |
| Seated Height-Max | 1.7 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | PLASTIC, BGA-352 | |
| Pin Count | 352 | |
| Reach Compliance Code | not_compliant | |
| HTS Code | 8542.39.00.01 |
XC40150XV-09BG352I Datasheet Download
XC40150XV-09BG352I Overview
The chip model XC40150XV-09BG352I is a high-performance digital signal processor that is suitable for high-performance digital signal processing, embedded processing, image processing, and other applications. It is designed to be used with a high-level hardware description language (HDL) to create complex digital systems.
The XC40150XV-09BG352I chip model is designed to meet the current industry trends, and is capable of scaling up in the future. As the industry evolves, the chip model is able to keep up with the latest technologies and advancements. This allows it to be applied to a wide range of applications, including advanced communication systems.
The design intention of the XC40150XV-09BG352I chip model is to provide a platform for users to create high-performance digital systems. It is designed to be flexible, allowing users to customize their systems to meet their specific needs. The chip model also allows for future upgrades, allowing users to take advantage of new technologies as they become available.
The XC40150XV-09BG352I chip model is an ideal solution for those looking for a high-performance digital signal processor that can be used for a variety of applications. It is designed to be flexible and scalable, allowing users to create complex digital systems that can be adapted to their specific needs. The chip model also allows for future upgrades, allowing users to take advantage of new technologies as they become available.
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Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| No reference price found. | ||