AMD Xilinx
XC40150XV-09BG352C
XC40150XV-09BG352C ECAD Model
XC40150XV-09BG352C Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 2.5 V | |
| Number of Inputs | 448 | |
| Number of Outputs | 448 | |
| Number of Logic Cells | 5184 | |
| Number of Equivalent Gates | 100000 | |
| Number of CLBs | 5184 | |
| Combinatorial Delay of a CLB-Max | 1.3 ns | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 5184 CLBS, 100000 GATES | |
| Additional Feature | CAN ALSO USE 300000 GATES | |
| Clock Frequency-Max | 225 MHz | |
| Power Supplies | 2.5,3.3 V | |
| Supply Voltage-Max | 2.7 V | |
| Supply Voltage-Min | 2.3 V | |
| JESD-30 Code | S-PBGA-B352 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | 225 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 352 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LBGA | |
| Package Equivalence Code | BGA352,26X26,50 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, LOW PROFILE | |
| Surface Mount | YES | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | BALL | |
| Terminal Pitch | 1.27 mm | |
| Terminal Position | BOTTOM | |
| Width | 35 mm | |
| Length | 35 mm | |
| Seated Height-Max | 1.7 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | PLASTIC, BGA-352 | |
| Pin Count | 352 | |
| Reach Compliance Code | not_compliant | |
| HTS Code | 8542.39.00.01 |
XC40150XV-09BG352C Datasheet Download
XC40150XV-09BG352C Overview
The chip model XC40150XV-09BG352C is a high-performance chip that has been developed by a leading semiconductor company. It is designed to provide a reliable and cost-effective solution for a wide range of applications. The chip model is capable of providing high-speed data transmission, low power consumption, and advanced security features. It is also capable of providing a wide range of features such as low-voltage operation, high-speed communication, and efficient power management.
The chip model XC40150XV-09BG352C has been well-received in the market and is expected to be increasingly adopted by a wide range of industries in the future. This is due to its ability to provide reliable and cost-effective solutions for a wide range of applications. It is also expected to be used in a wide range of networks and intelligent scenarios in the future. The chip model is capable of providing a wide range of features such as low-voltage operation, high-speed communication, and efficient power management.
The industry trends of the chip model XC40150XV-09BG352C and the expected demand trends for the model in related industries in the future are expected to be positive. This is due to its ability to provide reliable and cost-effective solutions for a wide range of applications. It is also expected to be increasingly used in a wide range of networks and intelligent scenarios in the future.
The possible future applications of the chip model XC40150XV-09BG352C in networks and which intelligent scenarios it may be applied to, as well as whether it is possible to be used in the era of fully intelligent systems, depend on what specific technologies are needed. The chip model is capable of providing features such as low-voltage operation, high-speed communication, and efficient power management. It is also capable of providing advanced security features and is expected to be increasingly used in a wide range of networks and intelligent scenarios in the future.
In conclusion, the chip model XC40150XV-09BG352C is a high-performance chip that has been developed by a leading semiconductor company. It is designed to provide a reliable and cost-effective solution for a wide range of applications. The industry trends of the chip model XC40150XV-09BG352C and the expected demand trends for the model in related industries in the future are expected to be positive. The possible future applications of the chip model XC40150XV-09BG352C in networks and which intelligent scenarios it may be applied to, as well as whether it is possible to be used in the era of fully intelligent systems, depend on what specific technologies are needed.
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Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| No reference price found. | ||