AMD Xilinx
XC40150XV-08HQ240C
XC40150XV-08HQ240C ECAD Model
XC40150XV-08HQ240C Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 2.5 V | |
| Number of Inputs | 448 | |
| Number of Outputs | 448 | |
| Number of Logic Cells | 5184 | |
| Number of Equivalent Gates | 100000 | |
| Number of CLBs | 5184 | |
| Combinatorial Delay of a CLB-Max | 1.1 ns | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 5184 CLBS, 100000 GATES | |
| Additional Feature | CAN ALSO USE 300000 GATES | |
| Clock Frequency-Max | 258 MHz | |
| Power Supplies | 2.5,3.3 V | |
| Supply Voltage-Max | 2.7 V | |
| Supply Voltage-Min | 2.3 V | |
| JESD-30 Code | S-PQFP-G240 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | 225 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 240 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | HFQFP | |
| Package Equivalence Code | HQFP240,1.37SQ,20 | |
| Package Shape | SQUARE | |
| Package Style | FLATPACK, HEAT SINK/SLUG, FINE PITCH | |
| Surface Mount | YES | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | GULL WING | |
| Terminal Pitch | 500 µm | |
| Terminal Position | QUAD | |
| Width | 32 mm | |
| Length | 32 mm | |
| Seated Height-Max | 4.1 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | QFP | |
| Package Description | QFP-240 | |
| Pin Count | 240 | |
| Reach Compliance Code | unknown | |
| HTS Code | 8542.39.00.01 |
XC40150XV-08HQ240C Datasheet Download
XC40150XV-08HQ240C Overview
The XC40150XV-08HQ240C chip model is a powerful tool for digital signal processing, embedded processing, and image processing. It is designed to support the use of HDL language, allowing users to utilize the chip model for a wide range of applications. In addition, the XC40150XV-08HQ240C chip model is also capable of providing high-performance computing power and is suitable for many different industries.
The industry trends of the chip model XC40150XV-08HQ240C and the future development of related industries are contingent upon the specific technologies that are required. For example, if the application environment requires the support of new technologies, the chip model can be used to provide the necessary power and performance. Additionally, the product description and specific design requirements of the chip model XC40150XV-08HQ240C should be taken into consideration when determining the appropriate technologies for the application environment.
In order to ensure the successful implementation of the XC40150XV-08HQ240C chip model, it is important to consider the actual case studies and precautions. For example, the chip model should be tested in the specific application environment to ensure that it meets the required performance standards. Additionally, it is important to consider the power consumption of the chip model and any other factors that may affect the performance of the chip model.
Overall, the XC40150XV-08HQ240C chip model is a powerful tool for digital signal processing, embedded processing, and image processing. It is important to consider the industry trends of the chip model and the future development of related industries, as well as the product description and specific design requirements of the chip model. Additionally, actual case studies and precautions should also be taken into consideration when assessing the performance of the chip model.
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| QTY | Unit Price | Ext Price |
|---|---|---|
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