AMD Xilinx
XC40150XV-08BG560I
XC40150XV-08BG560I ECAD Model
XC40150XV-08BG560I Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 2.5 V | |
| Number of Inputs | 448 | |
| Number of Outputs | 448 | |
| Number of Logic Cells | 5184 | |
| Number of Equivalent Gates | 100000 | |
| Number of CLBs | 5184 | |
| Combinatorial Delay of a CLB-Max | 1.1 ns | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 5184 CLBS, 100000 GATES | |
| Additional Feature | CAN ALSO USE 300000 GATES | |
| Clock Frequency-Max | 258 MHz | |
| Power Supplies | 2.5,3.3 V | |
| Supply Voltage-Max | 2.7 V | |
| Supply Voltage-Min | 2.3 V | |
| JESD-30 Code | S-PBGA-B560 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 3 | |
| Peak Reflow Temperature (Cel) | 225 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 560 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LBGA | |
| Package Equivalence Code | BGA560,33X33,50 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, LOW PROFILE | |
| Surface Mount | YES | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | BALL | |
| Terminal Pitch | 1.27 mm | |
| Terminal Position | BOTTOM | |
| Width | 42.5 mm | |
| Length | 42.5 mm | |
| Seated Height-Max | 1.7 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | PLASTIC, BGA-560 | |
| Pin Count | 560 | |
| Reach Compliance Code | not_compliant | |
| HTS Code | 8542.39.00.01 |
XC40150XV-08BG560I Datasheet Download
XC40150XV-08BG560I Overview
The chip model XC40150XV-08BG560I is a new development in the world of network technology. This chip model is designed to provide high-speed, reliable, and secure data transmission and processing. With its advanced features, the XC40150XV-08BG560I is capable of handling complex tasks and can be used in a wide range of applications.
The XC40150XV-08BG560I is designed to be used in networks and is ideal for intelligent scenarios. It can be used in the era of fully intelligent systems, allowing for the development of smarter networks and the implementation of more advanced applications. This chip model is capable of handling large amounts of data and is designed for high-speed communication and data processing.
The XC40150XV-08BG560I is designed to provide a reliable and secure connection with minimal latency. It is also designed to be energy-efficient and can be used in a variety of different applications. The chip model is also capable of handling complex tasks and is designed to be used in a wide range of intelligent scenarios.
The product description and specific design requirements of the XC40150XV-08BG560I are available on the manufacturer's website. This includes detailed information on the chip model's features, specifications, and design requirements. It is important to read the product description and design requirements carefully before using the chip model. Additionally, it is important to read actual case studies and follow any precautions that may be necessary for the successful use of the chip model.
The XC40150XV-08BG560I can also be applied to the development and popularization of future intelligent robots. This chip model is designed to be used in intelligent robots, allowing for the development of smarter robots that can perform complex tasks. In order to use the chip model effectively, it is important to have the necessary technical knowledge and skills.
In conclusion, the chip model XC40150XV-08BG560I is a new development in the world of network technology. It is designed to provide high-speed, reliable, and secure data transmission and processing. The XC40150XV-08BG560I is ideal for intelligent scenarios and can be used in the era of fully intelligent systems. It can also be used in the development and popularization of future intelligent robots. However, it is important to read the product description and design requirements carefully before using the chip model, as well as to follow any precautions that may be necessary for the successful use of the chip model.
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Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| No reference price found. | ||