AMD Xilinx
XC40150XV-08BG352I
XC40150XV-08BG352I ECAD Model
XC40150XV-08BG352I Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 2.5 V | |
| Number of Inputs | 448 | |
| Number of Outputs | 448 | |
| Number of Logic Cells | 5184 | |
| Number of Equivalent Gates | 100000 | |
| Number of CLBs | 5184 | |
| Combinatorial Delay of a CLB-Max | 1.1 ns | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 5184 CLBS, 100000 GATES | |
| Additional Feature | CAN ALSO USE 300000 GATES | |
| Clock Frequency-Max | 258 MHz | |
| Power Supplies | 2.5,3.3 V | |
| Supply Voltage-Max | 2.7 V | |
| Supply Voltage-Min | 2.3 V | |
| JESD-30 Code | S-PBGA-B352 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 3 | |
| Peak Reflow Temperature (Cel) | 225 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 352 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LBGA | |
| Package Equivalence Code | BGA352,26X26,50 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, LOW PROFILE | |
| Surface Mount | YES | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | BALL | |
| Terminal Pitch | 1.27 mm | |
| Terminal Position | BOTTOM | |
| Width | 35 mm | |
| Length | 35 mm | |
| Seated Height-Max | 1.7 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | PLASTIC, BGA-352 | |
| Pin Count | 352 | |
| Reach Compliance Code | not_compliant | |
| HTS Code | 8542.39.00.01 |
XC40150XV-08BG352I Datasheet Download
XC40150XV-08BG352I Overview
The chip model XC40150XV-08BG352I is a powerful and versatile model that can be used to support high-performance digital signal processing, embedded processing, and image processing. It requires the use of HDL language, a high-level language that is specifically designed for hardware description and verification. This makes the chip model XC40150XV-08BG352I an ideal choice for those looking to develop and deploy sophisticated and reliable digital signal processing applications.
The chip model XC40150XV-08BG352I can be used in networks and intelligent scenarios, and is expected to play an important role in the development and popularization of future intelligent robots. Its powerful processing capabilities make it well-suited to tasks such as facial recognition, object tracking, and natural language processing. It is also possible to use the chip model XC40150XV-08BG352I in the era of fully intelligent systems, where it can be used to develop and deploy complex and sophisticated applications.
In order to use the chip model XC40150XV-08BG352I effectively, it is important to have a good understanding of HDL language. A good grasp of HDL language is essential for developing and deploying the chip model XC40150XV-08BG352I in networks and intelligent scenarios. Those who are looking to use the chip model XC40150XV-08BG352I effectively should also have a good understanding of the underlying hardware, as well as the various software tools and libraries that are available for developing and deploying applications.
Overall, the chip model XC40150XV-08BG352I is an extremely powerful and versatile model that can be used in a wide range of applications. It is well-suited to tasks such as high-performance digital signal processing, embedded processing, and image processing. It is also possible to use the chip model XC40150XV-08BG352I in networks and intelligent scenarios, as well as in the era of fully intelligent systems. In order to use the chip model XC40150XV-08BG352I effectively, it is important to have a good understanding of HDL language and the underlying hardware, as well as the various software tools and libraries that are available for developing and deploying applications.
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Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| No reference price found. | ||