
AMD Xilinx
XC40150XV-08BG352C
XC40150XV-08BG352C ECAD Model
XC40150XV-08BG352C Attributes
Type | Description | Select |
---|---|---|
Rohs Code | No | |
Part Life Cycle Code | Obsolete | |
Supply Voltage-Nom | 2.5 V | |
Number of Inputs | 448 | |
Number of Outputs | 448 | |
Number of Logic Cells | 5184 | |
Number of Equivalent Gates | 100000 | |
Number of CLBs | 5184 | |
Combinatorial Delay of a CLB-Max | 1.1 ns | |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
Temperature Grade | OTHER | |
Package Shape | SQUARE | |
Technology | CMOS | |
Organization | 5184 CLBS, 100000 GATES | |
Additional Feature | CAN ALSO USE 300000 GATES | |
Clock Frequency-Max | 258 MHz | |
Power Supplies | 2.5,3.3 V | |
Supply Voltage-Max | 2.7 V | |
Supply Voltage-Min | 2.3 V | |
JESD-30 Code | S-PBGA-B352 | |
Qualification Status | Not Qualified | |
JESD-609 Code | e0 | |
Moisture Sensitivity Level | 3 | |
Operating Temperature-Max | 85 °C | |
Peak Reflow Temperature (Cel) | 225 | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Number of Terminals | 352 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | LBGA | |
Package Equivalence Code | BGA352,26X26,50 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY, LOW PROFILE | |
Surface Mount | YES | |
Terminal Finish | TIN LEAD | |
Terminal Form | BALL | |
Terminal Pitch | 1.27 mm | |
Terminal Position | BOTTOM | |
Width | 35 mm | |
Length | 35 mm | |
Seated Height-Max | 1.7 mm | |
Ihs Manufacturer | XILINX INC | |
Part Package Code | BGA | |
Package Description | PLASTIC, BGA-352 | |
Pin Count | 352 | |
Reach Compliance Code | not_compliant | |
HTS Code | 8542.39.00.01 |
XC40150XV-08BG352C Datasheet Download
XC40150XV-08BG352C Overview
The XC40150XV-08BG352C chip model is an advanced, high-performance digital signal processor (DSP) designed for embedded processing, image processing, and other high-performance applications. It is capable of handling complex tasks and operations with great speed and accuracy. This chip model is suitable for use with the HDL language, which is used to program and control digital circuits.
The XC40150XV-08BG352C chip model is a powerful tool for networking applications, as it can be used to process and analyze large amounts of data quickly and efficiently. It is also suitable for use in intelligent scenarios, such as machine learning and artificial intelligence. This chip model can be used to build intelligent systems that can learn from their environment and make decisions based on the data they receive.
The product description of the XC40150XV-08BG352C chip model includes its features, such as its high-performance processor, its compatibility with HDL language, and its ability to handle complex tasks. The design requirements for this chip model include the input and output formats, the type of data it can process, and the data rate it can handle.
Case studies of the XC40150XV-08BG352C chip model have shown that it is capable of performing complex tasks in a short amount of time. It has been used in a variety of applications, including facial recognition, speech recognition, and autonomous navigation.
When using the XC40150XV-08BG352C chip model, it is important to consider the power consumption, heat dissipation, and the compatibility of the HDL language. It is also important to evaluate the performance of the chip model in the application it is intended for.
In conclusion, the XC40150XV-08BG352C chip model is an advanced, high-performance digital signal processor designed for embedded processing, image processing, and other high-performance applications. It is suitable for use with the HDL language and can be used for networking applications and intelligent scenarios. The product description and design requirements for this chip model must be considered carefully, along with actual case studies and precautions. With its powerful capabilities, the XC40150XV-08BG352C chip model is a great tool for building intelligent systems for the era of fully intelligent systems.
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