AMD Xilinx
XC40150XV-07HQ240C
XC40150XV-07HQ240C ECAD Model
XC40150XV-07HQ240C Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 2.5 V | |
| Number of Inputs | 448 | |
| Number of Outputs | 448 | |
| Number of Logic Cells | 5184 | |
| Number of Equivalent Gates | 100000 | |
| Number of CLBs | 5184 | |
| Combinatorial Delay of a CLB-Max | 1 ns | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 5184 CLBS, 100000 GATES | |
| Additional Feature | CAN ALSO USE 300000 GATES | |
| Clock Frequency-Max | 296 MHz | |
| Power Supplies | 2.5,3.3 V | |
| Supply Voltage-Max | 2.7 V | |
| Supply Voltage-Min | 2.3 V | |
| JESD-30 Code | S-PQFP-G240 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | 225 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 240 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | HFQFP | |
| Package Equivalence Code | HQFP240,1.37SQ,20 | |
| Package Shape | SQUARE | |
| Package Style | FLATPACK, HEAT SINK/SLUG, FINE PITCH | |
| Surface Mount | YES | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | GULL WING | |
| Terminal Pitch | 500 µm | |
| Terminal Position | QUAD | |
| Width | 32 mm | |
| Length | 32 mm | |
| Seated Height-Max | 4.1 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | QFP | |
| Package Description | QFP-240 | |
| Pin Count | 240 | |
| Reach Compliance Code | unknown | |
| HTS Code | 8542.39.00.01 |
XC40150XV-07HQ240C Datasheet Download
XC40150XV-07HQ240C Overview
The XC40150XV-07HQ240C chip model has been developed to meet the growing demand for advanced communication systems. This model is designed to provide a wide range of capabilities, including high data transmission speeds, low power consumption, and high integration for multiple communication systems. The chip also has a wide range of applications, such as wireless networks, wired networks, and even in the era of fully intelligent systems.
The XC40150XV-07HQ240C chip model has been designed to provide a wide range of advantages, including high data transmission speeds, low power consumption, and high integration for multiple communication systems. It also has a wide range of applications, such as wireless networks, wired networks, and even in the era of fully intelligent systems. The chip model is also designed to provide enhanced security features, such as encryption and authentication, to ensure the safety of data transmission.
The XC40150XV-07HQ240C chip model has been designed with the intention of providing a wide range of advantages, including high data transmission speeds, low power consumption, and high integration for multiple communication systems. The chip model also has a wide range of applications, such as wireless networks, wired networks, and even in the era of fully intelligent systems. The chip model is also designed to provide enhanced security features, such as encryption and authentication, to ensure the safety of data transmission.
The XC40150XV-07HQ240C chip model is expected to continue to be in demand in the future as the need for advanced communication systems continues to grow. The chip model is also expected to be upgraded in the future, allowing for more advanced features and capabilities. The chip model is also expected to be increasingly used in intelligent scenarios, such as autonomous vehicles, smart homes, and other intelligent systems.
In conclusion, the XC40150XV-07HQ240C chip model is designed to provide a wide range of advantages, including high data transmission speeds, low power consumption, and high integration for multiple communication systems. The chip model is expected to be in demand in the future, and is expected to be upgraded to provide more advanced features and capabilities. The chip model is also expected to be increasingly used in intelligent scenarios, such as autonomous vehicles, smart homes, and other intelligent systems.
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Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| No reference price found. | ||