AMD Xilinx
XC4013XLA-09PQG208I
XC4013XLA-09PQG208I ECAD Model
XC4013XLA-09PQG208I Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 3.3 V | |
| Number of Equivalent Gates | 10000 | |
| Number of CLBs | 576 | |
| Combinatorial Delay of a CLB-Max | 1.1 ns | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 576 CLBS, 10000 GATES | |
| Additional Feature | CAN ALSO USE 30000 GATES | |
| Clock Frequency-Max | 227 MHz | |
| Supply Voltage-Max | 3.6 V | |
| Supply Voltage-Min | 3 V | |
| JESD-30 Code | S-PQFP-G208 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e3 | |
| Moisture Sensitivity Level | 3 | |
| Peak Reflow Temperature (Cel) | 245 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 208 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | FQFP | |
| Package Shape | SQUARE | |
| Package Style | FLATPACK, FINE PITCH | |
| Surface Mount | YES | |
| Terminal Finish | Matte Tin (Sn) | |
| Terminal Form | GULL WING | |
| Terminal Pitch | 500 µm | |
| Terminal Position | QUAD | |
| Width | 28 mm | |
| Length | 28 mm | |
| Seated Height-Max | 4.1 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | QFP | |
| Package Description | FQFP, | |
| Pin Count | 208 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 |
XC4013XLA-09PQG208I Datasheet Download
XC4013XLA-09PQG208I Overview
The chip model XC4013XLA-09PQG208I is a cutting-edge semiconductor technology developed by Xilinx, Inc. It is a highly integrated, low-power, low-cost solution that is designed to meet the needs of a wide range of applications. It features a high-speed, low-power FPGA architecture, which is capable of supporting a variety of embedded applications. The XC4013XLA-09PQG208I is also equipped with a wide range of peripherals, such as Ethernet, USB, and SPI, which can be used for various types of data transfer.
The XC4013XLA-09PQG208I is a highly versatile chip that can be used in a variety of applications, from consumer electronics to industrial automation. Its low-power, low-cost design makes it an attractive option for many applications. In addition, the chip is capable of supporting a wide range of technologies, including artificial intelligence, machine learning, and robotics. It is also capable of supporting a variety of communication protocols, such as Wi-Fi, Bluetooth, and Zigbee.
The future of the XC4013XLA-09PQG208I chip model is expected to be bright, as the demand for embedded systems continues to grow. As the technology continues to evolve, it is likely that the chip model will be used in more and more applications. As the technology becomes more advanced, the chip model will be able to support more sophisticated applications, such as intelligent robots.
In order to effectively use the XC4013XLA-09PQG208I, technical talent is needed. The chip model requires expertise in a variety of areas, such as embedded systems, artificial intelligence, machine learning, and robotics. In addition, the chip model requires knowledge of communication protocols, such as Wi-Fi, Bluetooth, and Zigbee. In order to effectively use the chip model, an individual must have a deep understanding of the technology and the capabilities of the chip model.
In conclusion, the XC4013XLA-09PQG208I chip model is a cutting-edge semiconductor technology developed by Xilinx, Inc. It is a highly integrated, low-power, low-cost solution that is designed to meet the needs of a wide range of applications. The chip model is expected to be used in more and more applications in the future, and it is capable of supporting a variety of technologies, such as artificial intelligence, machine learning, and robotics. In order to effectively use the chip model, technical talent is needed.
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|---|---|---|
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