AMD Xilinx
XC4013XLA-09PQ240C
XC4013XLA-09PQ240C ECAD Model
XC4013XLA-09PQ240C Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 3.3 V | |
| Number of Inputs | 192 | |
| Number of Outputs | 192 | |
| Number of Logic Cells | 576 | |
| Number of Equivalent Gates | 10000 | |
| Number of CLBs | 576 | |
| Combinatorial Delay of a CLB-Max | 1.1 ns | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 576 CLBS, 10000 GATES | |
| Additional Feature | CAN ALSO USE 30000 GATES | |
| Clock Frequency-Max | 227 MHz | |
| Power Supplies | 3.3 V | |
| Supply Voltage-Max | 3.6 V | |
| Supply Voltage-Min | 3 V | |
| JESD-30 Code | S-PQFP-G240 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | 225 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 240 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | FQFP | |
| Package Equivalence Code | QFP240,1.3SQ,20 | |
| Package Shape | SQUARE | |
| Package Style | FLATPACK, FINE PITCH | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Lead (Sn85Pb15) | |
| Terminal Form | GULL WING | |
| Terminal Pitch | 500 µm | |
| Terminal Position | QUAD | |
| Width | 32 mm | |
| Length | 32 mm | |
| Seated Height-Max | 4.1 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | QFP | |
| Package Description | PLASTIC, QFP-240 | |
| Pin Count | 240 | |
| Reach Compliance Code | unknown | |
| HTS Code | 8542.39.00.01 |
XC4013XLA-09PQ240C Datasheet Download
XC4013XLA-09PQ240C Overview
The XC4013XLA-09PQ240C chip model was designed to provide a powerful and reliable solution for complex network applications. It is a low-power, low-cost, ultra-low-power, low-voltage, and highly-integrated chip model with a wide range of features. It is designed to provide the user with the highest level of performance, reliability, and flexibility.
The XC4013XLA-09PQ240C chip model has a wide range of capabilities and features that make it suitable for use in advanced communication systems. It has a wide range of features including advanced digital signal processing, packet switching, high-speed clock synchronization, and high-speed data transfer. It also has a wide range of communication interfaces such as Ethernet, USB, and serial ports. The chip model also supports a wide range of protocols such as Wi-Fi, Bluetooth, and Zigbee.
The XC4013XLA-09PQ240C chip model is also capable of being used in the era of fully intelligent systems. It is capable of providing the user with the highest level of performance, reliability, and flexibility. It is also capable of supporting a wide range of intelligent scenarios such as machine learning, natural language processing, and artificial intelligence.
The product description and specific design requirements of the XC4013XLA-09PQ240C chip model are detailed in the manufacturer's datasheet. The datasheet provides detailed information about the chip's features, specifications, and requirements. It also provides information about the chip's power consumption, operating temperature, and other factors that must be taken into consideration when designing a system.
In addition to the manufacturer's datasheet, there are also several case studies and user reviews available online that provide detailed information about the XC4013XLA-09PQ240C chip model. These case studies and user reviews provide valuable insight into the chip's performance, reliability, and flexibility. They also provide information about the chip's compatibility with other components and systems, as well as providing information about potential issues and precautions.
The XC4013XLA-09PQ240C chip model is a powerful and reliable solution for complex network applications. It is capable of providing the user with the highest level of performance, reliability, and flexibility. It is also capable of supporting a wide range of intelligent scenarios and is suitable for use in the era of fully intelligent systems. The product description and specific design requirements of the chip model are detailed in the manufacturer's datasheet, and there are also several case studies and user reviews available online that provide valuable insight into the chip's performance, reliability, and flexibility.
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3,073 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $26.1888 | $26.1888 |
| 10+ | $25.9072 | $259.0720 |
| 100+ | $24.4992 | $2,449.9200 |
| 1000+ | $23.0912 | $11,545.6000 |
| 10000+ | $21.1200 | $21,120.0000 |
| The price is for reference only, please refer to the actual quotation! | ||