AMD Xilinx
XC4013XLA-09PQ160C
XC4013XLA-09PQ160C ECAD Model
XC4013XLA-09PQ160C Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 3.3 V | |
| Number of Inputs | 192 | |
| Number of Outputs | 192 | |
| Number of Logic Cells | 576 | |
| Number of Equivalent Gates | 10000 | |
| Number of CLBs | 576 | |
| Combinatorial Delay of a CLB-Max | 1.1 ns | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 576 CLBS, 10000 GATES | |
| Additional Feature | CAN ALSO USE 30000 GATES | |
| Clock Frequency-Max | 227 MHz | |
| Power Supplies | 3.3 V | |
| Supply Voltage-Max | 3.6 V | |
| Supply Voltage-Min | 3 V | |
| JESD-30 Code | S-PQFP-G160 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | 225 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 160 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | QFP | |
| Package Equivalence Code | QFP160,1.2SQ | |
| Package Shape | SQUARE | |
| Package Style | FLATPACK | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Lead (Sn85Pb15) | |
| Terminal Form | GULL WING | |
| Terminal Pitch | 650 µm | |
| Terminal Position | QUAD | |
| Width | 28 mm | |
| Length | 28 mm | |
| Seated Height-Max | 4.1 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | QFP | |
| Package Description | PLASTIC, QFP-160 | |
| Pin Count | 160 | |
| Reach Compliance Code | not_compliant | |
| HTS Code | 8542.39.00.01 |
XC4013XLA-09PQ160C Datasheet Download
XC4013XLA-09PQ160C Overview
The XC4013XLA-09PQ160C chip model is a powerful processor that is suitable for a variety of applications. It is designed to handle high-performance digital signal processing, embedded processing, and image processing. To achieve this, the chip requires the use of HDL language.
The chip's potential applications in networks and intelligent scenarios are vast and varied. It can be used in a wide range of industries, including medical, automotive, aerospace, and consumer electronics. Furthermore, the chip has the potential to be used in fully intelligent systems, as it is capable of handling complex tasks such as artificial intelligence, machine learning, and natural language processing.
The chip model's future development will depend on the specific technologies needed in the application environment. As technology continues to evolve, the chip model will need to be updated to keep up with the latest advancements. This could include the addition of new features, such as enhanced security, improved power efficiency, and increased processing power.
Overall, the XC4013XLA-09PQ160C chip model is a versatile and powerful processor that has the potential to be used in a variety of applications. Its ability to handle complex tasks and its potential for future development make it an ideal choice for a range of industries. With the right technologies in place, the chip model could play a major role in the future of intelligent systems.
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5,330 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $32.9443 | $32.9443 |
| 10+ | $32.5901 | $325.9008 |
| 100+ | $30.8189 | $3,081.8880 |
| 1000+ | $29.0477 | $14,523.8400 |
| 10000+ | $26.5680 | $26,568.0000 |
| The price is for reference only, please refer to the actual quotation! | ||