XC4013XLA-09BGG256C
XC4013XLA-09BGG256C
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rohs

AMD Xilinx

XC4013XLA-09BGG256C


XC4013XLA-09BGG256C
F20-XC4013XLA-09BGG256C
Active
FIELD PROGRAMMABLE GATE ARRAY, CMOS, BGA
BGA

XC4013XLA-09BGG256C ECAD Model


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XC4013XLA-09BGG256C Attributes


Type Description Select
Pbfree Code Yes
Rohs Code Yes
Part Life Cycle Code Obsolete
Supply Voltage-Nom 3.3 V
Number of Equivalent Gates 10000
Number of CLBs 576
Combinatorial Delay of a CLB-Max 1.1 ns
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Temperature Grade OTHER
Package Shape SQUARE
Technology CMOS
Organization 576 CLBS, 10000 GATES
Additional Feature CAN ALSO USE 30000 GATES
Clock Frequency-Max 227 MHz
Supply Voltage-Max 3.6 V
Supply Voltage-Min 3 V
JESD-30 Code S-PBGA-B256
Qualification Status Not Qualified
JESD-609 Code e1
Moisture Sensitivity Level 3
Operating Temperature-Max 85 °C
Peak Reflow Temperature (Cel) 250
Time@Peak Reflow Temperature-Max (s) 30
Number of Terminals 256
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Shape SQUARE
Package Style GRID ARRAY
Surface Mount YES
Terminal Finish Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)
Terminal Form BALL
Terminal Pitch 1.27 mm
Terminal Position BOTTOM
Width 27 mm
Length 27 mm
Seated Height-Max 2.55 mm
Ihs Manufacturer XILINX INC
Part Package Code BGA
Package Description BGA,
Pin Count 256
Reach Compliance Code compliant
HTS Code 8542.39.00.01

XC4013XLA-09BGG256C Datasheet Download


XC4013XLA-09BGG256C Overview



The XC4013XLA-09BGG256C chip model is an integrated circuit that offers a range of features and capabilities. It is designed to be used in a variety of applications, including embedded systems, consumer electronics, and industrial automation. With its advanced features and capabilities, the chip model can provide an efficient and cost-effective solution for many applications.


The XC4013XLA-09BGG256C chip model is a highly versatile and powerful integrated circuit that can be used for a variety of applications. It has a wide range of features, including a high-speed processor, high-bandwidth memory, and high-speed communication protocols. This makes it ideal for applications such as industrial automation, consumer electronics, and embedded systems.


In terms of industry trends, the XC4013XLA-09BGG256C chip model is expected to be increasingly used in the future. As the demand for high-performance, low-power integrated circuits continues to rise, the XC4013XLA-09BGG256C chip model is likely to be increasingly used in a variety of applications. In addition, the chip model is expected to be used in the development and popularization of future intelligent robots.


In order to use the XC4013XLA-09BGG256C chip model effectively, certain technical talents are needed. This includes knowledge of programming languages, such as C and C++, as well as knowledge of embedded systems and microcontrollers. Additionally, knowledge of communication protocols, such as Ethernet, Wi-Fi, and Bluetooth, is also necessary.


The XC4013XLA-09BGG256C chip model is a versatile and powerful integrated circuit that can be used for a variety of applications. Its advanced features and capabilities make it an ideal choice for a variety of applications, and its expected demand in the future suggests that it will be increasingly used in a variety of applications. In addition, the chip model is expected to be used in the development and popularization of future intelligent robots. In order to use the model effectively, certain technical talents are needed, including knowledge of programming languages, embedded systems, and communication protocols.



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Unit Price: $66.12
The price is for reference only.
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Pricing (USD)

QTY Unit Price Ext Price
1+ $61.4916 $61.4916
10+ $60.8304 $608.3040
100+ $57.5244 $5,752.4400
1000+ $54.2184 $27,109.2000
10000+ $49.5900 $49,590.0000
The price is for reference only, please refer to the actual quotation!

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