
AMD Xilinx
XC4013XLA-09BGG256C
XC4013XLA-09BGG256C ECAD Model
XC4013XLA-09BGG256C Attributes
Type | Description | Select |
---|---|---|
Pbfree Code | Yes | |
Rohs Code | Yes | |
Part Life Cycle Code | Obsolete | |
Supply Voltage-Nom | 3.3 V | |
Number of Equivalent Gates | 10000 | |
Number of CLBs | 576 | |
Combinatorial Delay of a CLB-Max | 1.1 ns | |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
Temperature Grade | OTHER | |
Package Shape | SQUARE | |
Technology | CMOS | |
Organization | 576 CLBS, 10000 GATES | |
Additional Feature | CAN ALSO USE 30000 GATES | |
Clock Frequency-Max | 227 MHz | |
Supply Voltage-Max | 3.6 V | |
Supply Voltage-Min | 3 V | |
JESD-30 Code | S-PBGA-B256 | |
Qualification Status | Not Qualified | |
JESD-609 Code | e1 | |
Moisture Sensitivity Level | 3 | |
Operating Temperature-Max | 85 °C | |
Peak Reflow Temperature (Cel) | 250 | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Number of Terminals | 256 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY | |
Surface Mount | YES | |
Terminal Finish | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | |
Terminal Form | BALL | |
Terminal Pitch | 1.27 mm | |
Terminal Position | BOTTOM | |
Width | 27 mm | |
Length | 27 mm | |
Seated Height-Max | 2.55 mm | |
Ihs Manufacturer | XILINX INC | |
Part Package Code | BGA | |
Package Description | BGA, | |
Pin Count | 256 | |
Reach Compliance Code | compliant | |
HTS Code | 8542.39.00.01 |
XC4013XLA-09BGG256C Datasheet Download
XC4013XLA-09BGG256C Overview
The XC4013XLA-09BGG256C chip model is an integrated circuit that offers a range of features and capabilities. It is designed to be used in a variety of applications, including embedded systems, consumer electronics, and industrial automation. With its advanced features and capabilities, the chip model can provide an efficient and cost-effective solution for many applications.
The XC4013XLA-09BGG256C chip model is a highly versatile and powerful integrated circuit that can be used for a variety of applications. It has a wide range of features, including a high-speed processor, high-bandwidth memory, and high-speed communication protocols. This makes it ideal for applications such as industrial automation, consumer electronics, and embedded systems.
In terms of industry trends, the XC4013XLA-09BGG256C chip model is expected to be increasingly used in the future. As the demand for high-performance, low-power integrated circuits continues to rise, the XC4013XLA-09BGG256C chip model is likely to be increasingly used in a variety of applications. In addition, the chip model is expected to be used in the development and popularization of future intelligent robots.
In order to use the XC4013XLA-09BGG256C chip model effectively, certain technical talents are needed. This includes knowledge of programming languages, such as C and C++, as well as knowledge of embedded systems and microcontrollers. Additionally, knowledge of communication protocols, such as Ethernet, Wi-Fi, and Bluetooth, is also necessary.
The XC4013XLA-09BGG256C chip model is a versatile and powerful integrated circuit that can be used for a variety of applications. Its advanced features and capabilities make it an ideal choice for a variety of applications, and its expected demand in the future suggests that it will be increasingly used in a variety of applications. In addition, the chip model is expected to be used in the development and popularization of future intelligent robots. In order to use the model effectively, certain technical talents are needed, including knowledge of programming languages, embedded systems, and communication protocols.
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2,093 In Stock






Pricing (USD)
QTY | Unit Price | Ext Price |
---|---|---|
1+ | $61.4916 | $61.4916 |
10+ | $60.8304 | $608.3040 |
100+ | $57.5244 | $5,752.4400 |
1000+ | $54.2184 | $27,109.2000 |
10000+ | $49.5900 | $49,590.0000 |
The price is for reference only, please refer to the actual quotation! |