AMD Xilinx
XC4013XLA-08BG256I
XC4013XLA-08BG256I ECAD Model
XC4013XLA-08BG256I Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 3.3 V | |
| Number of Inputs | 192 | |
| Number of Outputs | 192 | |
| Number of Logic Cells | 576 | |
| Number of Equivalent Gates | 10000 | |
| Number of CLBs | 576 | |
| Combinatorial Delay of a CLB-Max | 1 ns | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 576 CLBS, 10000 GATES | |
| Additional Feature | CAN ALSO USE 30000 GATES | |
| Clock Frequency-Max | 263 MHz | |
| Power Supplies | 3.3 V | |
| Supply Voltage-Max | 3.6 V | |
| Supply Voltage-Min | 3 V | |
| JESD-30 Code | S-PBGA-B256 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 3 | |
| Peak Reflow Temperature (Cel) | 225 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 256 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA256,20X20,50 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Lead (Sn63Pb37) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1.27 mm | |
| Terminal Position | BOTTOM | |
| Width | 27 mm | |
| Length | 27 mm | |
| Seated Height-Max | 2.55 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | PLASTIC, BGA-256 | |
| Pin Count | 256 | |
| Reach Compliance Code | not_compliant | |
| HTS Code | 8542.39.00.01 |
XC4013XLA-08BG256I Datasheet Download
XC4013XLA-08BG256I Overview
The XC4013XLA-08BG256I chip model is one of the most advanced and powerful integrated circuits available in the market today. Developed by Xilinx, this model is a high-performance, low-power, and cost-effective solution for a wide range of applications. It is an ideal choice for both embedded and industrial applications, such as industrial automation, consumer electronics, automotive, and medical devices.
The XC4013XLA-08BG256I chip model is designed to meet the needs of modern embedded systems, providing high-speed data transfer and efficient processing. It is equipped with a 256-bit internal memory, allowing for data storage and retrieval with minimal power consumption. It is also equipped with a high-speed FPGA, allowing for fast and efficient data processing. Additionally, it supports multiple communication protocols, such as Ethernet, USB, and CAN, making it suitable for a wide range of applications.
The XC4013XLA-08BG256I chip model is expected to experience a surge in demand in the near future. As the use of embedded systems increases, the need for high-performance, low-power, and cost-effective solutions will also increase. The XC4013XLA-08BG256I chip model is well-suited to meet this demand, as it is equipped with the latest technologies and features.
The original design intention of the XC4013XLA-08BG256I chip model was to provide high-performance, low-power, and cost-effective solutions for a wide range of applications. With the latest technologies and features, it is capable of meeting the needs of modern embedded systems. As technology progresses, it is likely that the XC4013XLA-08BG256I chip model will be upgraded to support more advanced communication systems.
The XC4013XLA-08BG256I chip model can be applied to a wide range of networks, including wireless, cellular, and satellite networks. It can also be used in intelligent scenarios, such as autonomous vehicles, smart homes, and industrial automation. In the future, it is likely that the XC4013XLA-08BG256I chip model will be used in the era of fully intelligent systems, such as the Internet of Things (IoT). With its advanced features and capabilities, it is well-suited to be used in the era of fully intelligent systems.
In conclusion, the XC4013XLA-08BG256I chip model is a high-performance, low-power, and cost-effective solution for a wide range of applications. It is expected to experience a surge in demand in the near future, as the need for high-performance, low-power, and cost-effective solutions increases. The original design intention of the XC4013XLA-08BG256I chip model was to provide high-performance, low-power, and cost-effective solutions for a wide range of applications. It can be applied to a wide range of networks, including wireless, cellular, and satellite networks, and can be used in intelligent scenarios. In the future, it is likely that the XC4013XLA-08BG256I chip model will be used in the era of fully intelligent systems.
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|---|---|---|
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