
AMD Xilinx
XC4013XLA-07PQ240I
XC4013XLA-07PQ240I ECAD Model
XC4013XLA-07PQ240I Attributes
Type | Description | Select |
---|---|---|
Rohs Code | No | |
Part Life Cycle Code | Obsolete | |
Supply Voltage-Nom | 3.3 V | |
Number of Inputs | 192 | |
Number of Outputs | 192 | |
Number of Logic Cells | 576 | |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
Package Shape | SQUARE | |
Technology | CMOS | |
Clock Frequency-Max | 294 MHz | |
Power Supplies | 3.3 V | |
JESD-30 Code | S-PQFP-G240 | |
Qualification Status | Not Qualified | |
JESD-609 Code | e0 | |
Moisture Sensitivity Level | 3 | |
Peak Reflow Temperature (Cel) | 225 | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Number of Terminals | 240 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | QFP | |
Package Equivalence Code | QFP240,1.3SQ,20 | |
Package Shape | SQUARE | |
Package Style | FLATPACK | |
Surface Mount | YES | |
Terminal Finish | TIN LEAD | |
Terminal Form | GULL WING | |
Terminal Pitch | 500 µm | |
Terminal Position | QUAD | |
Ihs Manufacturer | XILINX INC | |
Reach Compliance Code | compliant | |
HTS Code | 8542.39.00.01 |
XC4013XLA-07PQ240I Datasheet Download
XC4013XLA-07PQ240I Overview
The XC4013XLA-07PQ240I chip model is a complex and powerful integrated circuit (IC) manufactured by Xilinx Corporation. It is a field programmable gate array (FPGA) that is designed to be used in a variety of applications including communication and embedded systems. It has been designed to offer high-speed performance, low power consumption, and a wide range of features.
The XC4013XLA-07PQ240I chip model is designed for applications where maximum speed and efficiency are required. It is capable of providing high-speed data transfer rates and can be used for a wide range of tasks including high-speed networking and high-speed signal processing. It also offers a variety of features such as high-speed signal processing, high-speed data transfer, and low power consumption.
In order to ensure that the XC4013XLA-07PQ240I chip model is suitable for the application environment, the design must be carefully considered. It is important to consider the application environment and the specific requirements of the application. For example, if the application requires high-speed data transfer, the chip must be able to handle the data transfer rate required. Additionally, if the application requires low power consumption, the chip must be able to provide the necessary power efficiency.
When considering the future development of the chip model, it is important to consider the industry trends and the possibility of future upgrades. The chip model may require new technologies in order to remain competitive and to meet the needs of the application environment. For example, if the application requires high-speed networking, the chip must be able to support the necessary networking technologies. Additionally, if the application requires low power consumption, the chip must be able to provide the necessary power efficiency.
In order to ensure that the XC4013XLA-07PQ240I chip model is suitable for the application environment, it is important to understand the product description and the specific design requirements. It is also important to consider actual case studies and any potential risks or issues that may arise. Additionally, it is important to consider industry trends and the possibility of future upgrades in order to ensure that the chip model is suitable for the application environment. By understanding the product description and the specific design requirements, as well as considering actual case studies and industry trends, it is possible to ensure that the XC4013XLA-07PQ240I chip model is suitable for the application environment.
3,162 In Stock






Pricing (USD)
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