XC4013XLA-07PQ240I
XC4013XLA-07PQ240I
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rohs

AMD Xilinx

XC4013XLA-07PQ240I


XC4013XLA-07PQ240I
F20-XC4013XLA-07PQ240I
Active
FIELD PROGRAMMABLE GATE ARRAY, CMOS
QFP240

XC4013XLA-07PQ240I ECAD Model


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XC4013XLA-07PQ240I Attributes


Type Description Select
Rohs Code No
Part Life Cycle Code Obsolete
Supply Voltage-Nom 3.3 V
Number of Inputs 192
Number of Outputs 192
Number of Logic Cells 576
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Package Shape SQUARE
Technology CMOS
Clock Frequency-Max 294 MHz
Power Supplies 3.3 V
JESD-30 Code S-PQFP-G240
Qualification Status Not Qualified
JESD-609 Code e0
Moisture Sensitivity Level 3
Peak Reflow Temperature (Cel) 225
Time@Peak Reflow Temperature-Max (s) 30
Number of Terminals 240
Package Body Material PLASTIC/EPOXY
Package Code QFP
Package Equivalence Code QFP240,1.3SQ,20
Package Shape SQUARE
Package Style FLATPACK
Surface Mount YES
Terminal Finish TIN LEAD
Terminal Form GULL WING
Terminal Pitch 500 µm
Terminal Position QUAD
Ihs Manufacturer XILINX INC
Reach Compliance Code compliant
HTS Code 8542.39.00.01

XC4013XLA-07PQ240I Datasheet Download


XC4013XLA-07PQ240I Overview



The XC4013XLA-07PQ240I chip model is a complex and powerful integrated circuit (IC) manufactured by Xilinx Corporation. It is a field programmable gate array (FPGA) that is designed to be used in a variety of applications including communication and embedded systems. It has been designed to offer high-speed performance, low power consumption, and a wide range of features.


The XC4013XLA-07PQ240I chip model is designed for applications where maximum speed and efficiency are required. It is capable of providing high-speed data transfer rates and can be used for a wide range of tasks including high-speed networking and high-speed signal processing. It also offers a variety of features such as high-speed signal processing, high-speed data transfer, and low power consumption.


In order to ensure that the XC4013XLA-07PQ240I chip model is suitable for the application environment, the design must be carefully considered. It is important to consider the application environment and the specific requirements of the application. For example, if the application requires high-speed data transfer, the chip must be able to handle the data transfer rate required. Additionally, if the application requires low power consumption, the chip must be able to provide the necessary power efficiency.


When considering the future development of the chip model, it is important to consider the industry trends and the possibility of future upgrades. The chip model may require new technologies in order to remain competitive and to meet the needs of the application environment. For example, if the application requires high-speed networking, the chip must be able to support the necessary networking technologies. Additionally, if the application requires low power consumption, the chip must be able to provide the necessary power efficiency.


In order to ensure that the XC4013XLA-07PQ240I chip model is suitable for the application environment, it is important to understand the product description and the specific design requirements. It is also important to consider actual case studies and any potential risks or issues that may arise. Additionally, it is important to consider industry trends and the possibility of future upgrades in order to ensure that the chip model is suitable for the application environment. By understanding the product description and the specific design requirements, as well as considering actual case studies and industry trends, it is possible to ensure that the XC4013XLA-07PQ240I chip model is suitable for the application environment.



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