AMD Xilinx
XC4013XLA-07BG256C
XC4013XLA-07BG256C ECAD Model
XC4013XLA-07BG256C Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 3.3 V | |
| Number of Inputs | 192 | |
| Number of Outputs | 192 | |
| Number of Logic Cells | 576 | |
| Number of Equivalent Gates | 10000 | |
| Number of CLBs | 576 | |
| Combinatorial Delay of a CLB-Max | 900 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 576 CLBS, 10000 GATES | |
| Additional Feature | CAN ALSO USE 30000 GATES | |
| Clock Frequency-Max | 294 MHz | |
| Power Supplies | 3.3 V | |
| Supply Voltage-Max | 3.6 V | |
| Supply Voltage-Min | 3 V | |
| JESD-30 Code | S-PBGA-B256 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | 225 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 256 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA256,20X20,50 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Lead (Sn63Pb37) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1.27 mm | |
| Terminal Position | BOTTOM | |
| Width | 27 mm | |
| Length | 27 mm | |
| Seated Height-Max | 2.55 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | PLASTIC, BGA-256 | |
| Pin Count | 256 | |
| Reach Compliance Code | not_compliant | |
| HTS Code | 8542.39.00.01 |
XC4013XLA-07BG256C Datasheet Download
XC4013XLA-07BG256C Overview
The XC4013XLA-07BG256C chip model is a powerful tool for high-performance digital signal processing, embedded processing, image processing, and other applications. It is designed to be used with a hardware description language (HDL) for improved performance. This chip model is well suited for modern applications that require high-speed and low-power operation.
The XC4013XLA-07BG256C chip model has a wide range of features, such as its 256-bit data width, 1.2GHz clock frequency, and 4KB of on-chip SRAM. It also has an embedded processor, a wide range of I/O ports, and a variety of memory configurations. This chip model is designed to be used in a variety of applications, such as image processing, communication, and control systems.
The product description and specific design requirements of the XC4013XLA-07BG256C are detailed in the product datasheet. This datasheet provides an overview of the chip model's features and capabilities, as well as detailed information on its architecture and design. Additionally, case studies and best practices are provided to help users understand how to use the chip model effectively.
The XC4013XLA-07BG256C chip model can be used to develop and popularize future intelligent robots. It is a powerful tool for creating robots that can perform complex tasks and interact with the environment. To use the chip model effectively, technical talents are needed who are familiar with hardware description languages, computer architecture, and embedded systems. Additionally, knowledge of robotics and artificial intelligence is necessary to create robots that can interact with their environment.
In conclusion, the XC4013XLA-07BG256C chip model is an excellent choice for high-performance digital signal processing, embedded processing, image processing, and other applications. It is designed to be used with a hardware description language, and provides a wide range of features and capabilities. Additionally, it can be used to develop and popularize future intelligent robots, but technical talents are needed to use the model effectively.
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