AMD Xilinx
XC4013XL-3HTG176C
XC4013XL-3HTG176C ECAD Model
XC4013XL-3HTG176C Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 3.3 V | |
| Number of Equivalent Gates | 10000 | |
| Number of CLBs | 576 | |
| Combinatorial Delay of a CLB-Max | 1.6 ns | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 576 CLBS, 10000 GATES | |
| Additional Feature | MAX USABLE 13000 LOGIC GATES | |
| Clock Frequency-Max | 166 MHz | |
| Supply Voltage-Max | 3.6 V | |
| Supply Voltage-Min | 3 V | |
| JESD-30 Code | S-PQFP-G176 | |
| Qualification Status | Not Qualified | |
| Operating Temperature-Max | 85 °C | |
| Number of Terminals | 176 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | HLFQFP | |
| Package Shape | SQUARE | |
| Package Style | FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH | |
| Surface Mount | YES | |
| Terminal Form | GULL WING | |
| Terminal Pitch | 500 µm | |
| Terminal Position | QUAD | |
| Width | 24 mm | |
| Length | 24 mm | |
| Seated Height-Max | 1.6 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | QFP | |
| Package Description | HLFQFP, | |
| Pin Count | 176 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 |
XC4013XL-3HTG176C Datasheet Download
XC4013XL-3HTG176C Overview
The XC4013XL-3HTG176C chip model is a cutting-edge technology that has been developed to meet the needs of the ever-evolving modern world. It is a highly advanced chip model that provides a wide range of features, making it suitable for a variety of applications. This chip model is designed to be used in a variety of industries, ranging from automotive to aerospace, and is designed to meet the needs of the most demanding applications.
The XC4013XL-3HTG176C chip model is a highly advanced chip model that has been designed to provide users with a wide range of features and capabilities. This includes the ability to support multiple power levels, a wide range of memory sizes, and a variety of communication protocols. It also includes a variety of features that are designed to improve performance, such as the ability to process data quickly and efficiently. Additionally, the chip model is designed to be highly reliable and durable, making it suitable for use in a variety of environments.
The XC4013XL-3HTG176C chip model is designed to be used in a variety of industries, and its features are designed to meet the needs of the most demanding applications. This includes the ability to support multiple power levels, a wide range of memory sizes, and a variety of communication protocols. Additionally, the chip model is designed to be highly reliable and durable, making it suitable for use in a variety of environments. As such, the chip model is expected to have a high demand in the future, as more and more applications require this technology.
In order to ensure that the XC4013XL-3HTG176C chip model is used in the most effective way, it is important to understand the product description and specific design requirements of the chip model. This includes the ability to support multiple power levels, a wide range of memory sizes, and a variety of communication protocols. Additionally, the chip model is designed to be highly reliable and durable, making it suitable for use in a variety of environments. It is also important to understand the actual case studies and precautions associated with the chip model, as these will help users to ensure that the chip model is used in the most effective way.
Overall, the XC4013XL-3HTG176C chip model is a highly advanced chip model that is designed to meet the needs of the most demanding applications. It is designed to be used in a variety of industries, and its features are designed to meet the needs of the most demanding applications. Additionally, it is important to understand the product description and specific design requirements of the chip model, as well as the actual case studies and precautions associated with the chip model, in order to ensure that the chip model is used in the most effective way. As such, the chip model is expected to have a high demand in the future, as more and more applications require this technology.
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5,451 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $43.7902 | $43.7902 |
| 10+ | $43.3193 | $433.1930 |
| 100+ | $40.9650 | $4,096.4994 |
| 1000+ | $38.6107 | $19,305.3420 |
| 10000+ | $35.3147 | $35,314.6500 |
| The price is for reference only, please refer to the actual quotation! | ||