AMD Xilinx
XC4013XL-3HTG144C
XC4013XL-3HTG144C ECAD Model
XC4013XL-3HTG144C Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 3.3 V | |
| Number of Equivalent Gates | 10000 | |
| Number of CLBs | 576 | |
| Combinatorial Delay of a CLB-Max | 1.6 ns | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 576 CLBS, 10000 GATES | |
| Additional Feature | MAX USABLE 13000 LOGIC GATES | |
| Clock Frequency-Max | 166 MHz | |
| Supply Voltage-Max | 3.6 V | |
| Supply Voltage-Min | 3 V | |
| JESD-30 Code | S-PQFP-G144 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e3 | |
| Operating Temperature-Max | 85 °C | |
| Number of Terminals | 144 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | HLFQFP | |
| Package Shape | SQUARE | |
| Package Style | FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH | |
| Surface Mount | YES | |
| Terminal Finish | MATTE TIN | |
| Terminal Form | GULL WING | |
| Terminal Pitch | 500 µm | |
| Terminal Position | QUAD | |
| Width | 20 mm | |
| Length | 20 mm | |
| Seated Height-Max | 1.6 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | QFP | |
| Package Description | HLFQFP, | |
| Pin Count | 144 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 |
XC4013XL-3HTG144C Datasheet Download
XC4013XL-3HTG144C Overview
The XC4013XL-3HTG144C chip model has become increasingly popular in the chip industry, as it offers a range of features and benefits that make it an attractive choice for a variety of applications. This model is designed to provide a high-speed, low-power solution for a wide range of applications, including data processing, communications, and embedded systems.
The XC4013XL-3HTG144C chip model is based on a 32-bit RISC architecture, which provides a high level of performance and scalability. This model is also capable of supporting a wide range of advanced communication protocols, such as Ethernet, Wi-Fi, and Bluetooth, making it ideal for use in modern communication systems. Additionally, the chip is designed to be highly energy-efficient, making it suitable for use in battery-powered devices.
The XC4013XL-3HTG144C chip model is also designed to be easily upgradable, allowing for the development of new features and capabilities. This makes the chip model ideal for use in advanced communication systems, as well as for use in the development of future intelligent robots. In order to use the chip model effectively, it is important to have knowledge of the chip's technical specifications and capabilities. Additionally, it is important to have a good understanding of the technologies used in the chip model, such as embedded programming, signal processing, and hardware design.
In terms of industry trends, it is likely that the XC4013XL-3HTG144C chip model will continue to be used in a variety of applications, as it offers an excellent combination of performance, scalability, and energy efficiency. Additionally, the chip model is likely to be used in the development of new technologies, as it is capable of supporting a wide range of advanced communication protocols. As the chip model continues to be used in a variety of applications, it is likely that it will become increasingly popular in the chip industry.
Overall, the XC4013XL-3HTG144C chip model is an excellent choice for a wide range of applications, as it offers a high level of performance and scalability. Additionally, the chip model is designed to be easily upgradable, allowing for the development of new features and capabilities. As such, the XC4013XL-3HTG144C chip model is likely to continue to be used in a variety of applications, and it is likely to be used in the development of new technologies. In order to use the chip model effectively, it is important to have knowledge of the chip's technical specifications and capabilities, as well as a good understanding of the technologies used in the chip model.
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2,431 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $31.5908 | $31.5908 |
| 10+ | $31.2511 | $312.5111 |
| 100+ | $29.5527 | $2,955.2682 |
| 1000+ | $27.8543 | $13,927.1260 |
| 10000+ | $25.4765 | $25,476.4500 |
| The price is for reference only, please refer to the actual quotation! | ||