AMD Xilinx
XC4013XL-08PQ208C
XC4013XL-08PQ208C ECAD Model
XC4013XL-08PQ208C Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 3.3 V | |
| Number of Inputs | 192 | |
| Number of Outputs | 192 | |
| Number of Logic Cells | 576 | |
| Number of Equivalent Gates | 10000 | |
| Number of CLBs | 576 | |
| Combinatorial Delay of a CLB-Max | 1.1 ns | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 576 CLBS, 10000 GATES | |
| Additional Feature | TYPICAL GATES = 10000-30000 | |
| Clock Frequency-Max | 238 MHz | |
| Power Supplies | 3.3 V | |
| Supply Voltage-Max | 3.6 V | |
| Supply Voltage-Min | 3 V | |
| JESD-30 Code | S-PQFP-G208 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | 225 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 208 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | FQFP | |
| Package Equivalence Code | QFP208,1.2SQ,20 | |
| Package Shape | SQUARE | |
| Package Style | FLATPACK, FINE PITCH | |
| Surface Mount | YES | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | GULL WING | |
| Terminal Pitch | 500 µm | |
| Terminal Position | QUAD | |
| Width | 28 mm | |
| Length | 28 mm | |
| Seated Height-Max | 4.1 mm | |
| Ihs Manufacturer | XILINX INC | |
| Reach Compliance Code | unknown | |
| HTS Code | 8542.39.00.01 |
XC4013XL-08PQ208C Datasheet Download
XC4013XL-08PQ208C Overview
The chip model XC4013XL-08PQ208C is an advanced and powerful integrated circuit designed to provide high-performance digital signal processing, embedded processing, and image processing capabilities. It is designed to be used in conjunction with the HDL language and is suitable for a variety of applications, such as advanced communication systems.
The original design intention of the chip model XC4013XL-08PQ208C was to provide a powerful and reliable solution for high-performance digital signal processing, embedded processing, and image processing. The chip model is capable of being upgraded in the future to provide more advanced features and capabilities. It can also be used in advanced communication systems, allowing for reliable and efficient data transmission.
The product description and specific design requirements of the chip model XC4013XL-08PQ208C are detailed in the manufacturer's documentation. It is important to note that the chip model requires the use of HDL language, which is a powerful and complex language that must be used properly in order to achieve the desired results. Additionally, the chip model is designed to be used in conjunction with other components, such as memory and peripheral devices, in order to provide the desired capabilities.
There are a variety of case studies and examples available that demonstrate the use of the chip model XC4013XL-08PQ208C. These can provide valuable insight into the capabilities of the chip model and can be used to determine the best way to implement the chip model in a particular application. Additionally, there are a number of precautions that should be taken when using the chip model, such as avoiding excessive current draw and ensuring proper cooling.
In conclusion, the chip model XC4013XL-08PQ208C is a powerful and reliable integrated circuit designed to provide high-performance digital signal processing, embedded processing, and image processing capabilities. It is designed to be used in conjunction with the HDL language and is suitable for a variety of applications, such as advanced communication systems. The product description and specific design requirements of the chip model are detailed in the manufacturer's documentation, and there are a variety of case studies and examples available that demonstrate the use of the chip model. Additionally, there are a number of precautions that should be taken when using the chip model, such as avoiding excessive current draw and ensuring proper cooling.
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3,650 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $80.3520 | $80.3520 |
| 10+ | $79.4880 | $794.8800 |
| 100+ | $75.1680 | $7,516.8000 |
| 1000+ | $70.8480 | $35,424.0000 |
| 10000+ | $64.8000 | $64,800.0000 |
| The price is for reference only, please refer to the actual quotation! | ||