XC4013E-3PQG208I
XC4013E-3PQG208I
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rohs

AMD Xilinx

XC4013E-3PQG208I


XC4013E-3PQG208I
F20-XC4013E-3PQG208I
Active
FIELD PROGRAMMABLE GATE ARRAY, CMOS, FQFP
FQFP

XC4013E-3PQG208I ECAD Model


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XC4013E-3PQG208I Attributes


Type Description Select
Pbfree Code Yes
Rohs Code Yes
Part Life Cycle Code Obsolete
Supply Voltage-Nom 5 V
Number of Equivalent Gates 10000
Number of CLBs 576
Combinatorial Delay of a CLB-Max 2 ns
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Package Shape SQUARE
Technology CMOS
Organization 576 CLBS, 10000 GATES
Additional Feature MAX USABLE 13000 LOGIC GATES
Clock Frequency-Max 125 MHz
Supply Voltage-Max 5.5 V
Supply Voltage-Min 4.5 V
JESD-30 Code S-PQFP-G208
Qualification Status Not Qualified
JESD-609 Code e3
Moisture Sensitivity Level 3
Peak Reflow Temperature (Cel) 245
Time@Peak Reflow Temperature-Max (s) 30
Number of Terminals 208
Package Body Material PLASTIC/EPOXY
Package Code FQFP
Package Shape SQUARE
Package Style FLATPACK, FINE PITCH
Surface Mount YES
Terminal Finish MATTE TIN
Terminal Form GULL WING
Terminal Pitch 500 µm
Terminal Position QUAD
Width 28 mm
Length 28 mm
Seated Height-Max 4.1 mm
Ihs Manufacturer XILINX INC
Part Package Code QFP
Package Description FQFP,
Pin Count 208
Reach Compliance Code compliant
HTS Code 8542.39.00.01

XC4013E-3PQG208I Datasheet Download


XC4013E-3PQG208I Overview



The XC4013E-3PQG208I chip model is an important component of the electronic industry, and is widely used in various industries. With the rapid development of technology, the demand for this chip model is also increasing. This article will discuss the industry trends of XC4013E-3PQG208I, the future development of related industries, and the potential application environment that may require new technologies.


XC4013E-3PQG208I is a low-power, low-cost, high-performance chip model. It is a high-performance, low-power field-programmable gate array (FPGA) that provides a wide range of features and functions. It is designed to provide a high level of performance, while consuming low power. The chip model is also highly reliable, with a low failure rate.


The advantages of XC4013E-3PQG208I chip model include its low power consumption, high performance, and low cost. It is also highly reliable and has a low failure rate. Its features and functions make it suitable for use in many applications, including industrial automation, automotive, and consumer electronics.


The future development of related industries is expected to be driven by the increasing demand for XC4013E-3PQG208I chip models. This is due to its low power consumption, high performance, and low cost. As technology advances, new applications are expected to emerge that require the support of XC4013E-3PQG208I chip models.


The product description and specific design requirements of the XC4013E-3PQG208I chip model are important to consider when evaluating the potential applications. The chip model is designed to provide a wide range of features and functions, including low power consumption, high performance, and low cost. It is also highly reliable, with a low failure rate.


In addition to the product description, actual case studies and precautions should also be taken into account when evaluating the potential applications. For example, when considering the use of XC4013E-3PQG208I chip models in automotive applications, it is important to consider the safety and reliability of the system. Additionally, when considering the use of XC4013E-3PQG208I chip models in industrial automation applications, the system must be able to handle a wide range of environmental conditions.


In conclusion, the XC4013E-3PQG208I chip model is an important component of the electronic industry, and is widely used in various industries. Its features and functions make it suitable for use in many applications, including industrial automation, automotive, and consumer electronics. The future development of related industries is expected to be driven by the increasing demand for XC4013E-3PQG208I chip models. Additionally, when evaluating the potential applications of the chip model, the product description, actual case studies, and precautions should be taken into account.



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