
AMD Xilinx
XC4013E-3HQG208I
XC4013E-3HQG208I ECAD Model
XC4013E-3HQG208I Attributes
Type | Description | Select |
---|---|---|
Pbfree Code | Yes | |
Rohs Code | Yes | |
Part Life Cycle Code | Obsolete | |
Supply Voltage-Nom | 5 V | |
Number of Equivalent Gates | 10000 | |
Number of CLBs | 576 | |
Combinatorial Delay of a CLB-Max | 2 ns | |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
Package Shape | SQUARE | |
Technology | CMOS | |
Organization | 576 CLBS, 10000 GATES | |
Additional Feature | MAX USABLE 13000 LOGIC GATES | |
Clock Frequency-Max | 125 MHz | |
Supply Voltage-Max | 5.5 V | |
Supply Voltage-Min | 4.5 V | |
JESD-30 Code | S-PQFP-G208 | |
Qualification Status | Not Qualified | |
JESD-609 Code | e3 | |
Moisture Sensitivity Level | 3 | |
Peak Reflow Temperature (Cel) | 245 | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Number of Terminals | 208 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | HFQFP | |
Package Shape | SQUARE | |
Package Style | FLATPACK, HEAT SINK/SLUG, FINE PITCH | |
Surface Mount | YES | |
Terminal Finish | MATTE TIN | |
Terminal Form | GULL WING | |
Terminal Pitch | 500 µm | |
Terminal Position | QUAD | |
Width | 28 mm | |
Length | 28 mm | |
Seated Height-Max | 4.1 mm | |
Ihs Manufacturer | XILINX INC | |
Part Package Code | QFP | |
Package Description | HFQFP, | |
Pin Count | 208 | |
Reach Compliance Code | compliant | |
HTS Code | 8542.39.00.01 |
XC4013E-3HQG208I Datasheet Download
XC4013E-3HQG208I Overview
The XC4013E-3HQG208I chip model is a powerful and versatile integrated circuit that is suitable for a variety of applications. It is designed to provide high-performance digital signal processing, embedded processing, and image processing. It is also capable of using the hardware description language (HDL) for programming.
The XC4013E-3HQG208I chip model has the potential to be used in a wide range of intelligent scenarios. It is well-suited for use in networks, such as in the Internet of Things (IoT), where it can be used to process data from multiple sources. It can be used for machine learning, artificial intelligence, and autonomous systems. In the era of fully intelligent systems, the XC4013E-3HQG208I chip model can be used as a powerful and reliable tool for developing complex applications.
The product description of the XC4013E-3HQG208I chip model includes its features, capabilities, and design requirements. Its features include the ability to process digital signals, embedded processing, and image processing. It has a wide operating temperature range and is capable of operating in harsh environments. Its design requirements include the use of HDL and the ability to support multiple peripherals.
Case studies have been conducted to evaluate the performance of the XC4013E-3HQG208I chip model. These studies have shown that the chip model is capable of providing reliable and consistent performance in a variety of applications. It has also been found to be robust and reliable in harsh environments.
When using the XC4013E-3HQG208I chip model, it is important to follow certain precautions. It is important to ensure that the chip model is properly configured and that the HDL code is properly written. It is also important to ensure that the chip model is compatible with the peripherals and that the system is properly calibrated. Following these precautions will ensure that the chip model performs as expected.
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