AMD Xilinx
XC4013E-2BGG225C
XC4013E-2BGG225C ECAD Model
XC4013E-2BGG225C Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 5 V | |
| Number of Equivalent Gates | 10000 | |
| Number of CLBs | 576 | |
| Combinatorial Delay of a CLB-Max | 1.6 ns | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 576 CLBS, 10000 GATES | |
| Additional Feature | MAX USABLE 13000 LOGIC GATES | |
| Clock Frequency-Max | 125 MHz | |
| Supply Voltage-Max | 5.25 V | |
| Supply Voltage-Min | 4.75 V | |
| JESD-30 Code | S-PBGA-B225 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 85 °C | |
| Number of Terminals | 225 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | TIN SILVER COPPER | |
| Terminal Form | BALL | |
| Terminal Pitch | 1.5 mm | |
| Terminal Position | BOTTOM | |
| Width | 27 mm | |
| Length | 27 mm | |
| Seated Height-Max | 2.55 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | BGA, | |
| Pin Count | 225 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 |
XC4013E-2BGG225C Datasheet Download
XC4013E-2BGG225C Overview
The XC4013E-2BGG225C chip model is a high-performance digital signal processor that is suitable for embedded processing, image processing, and other applications. It requires the use of HDL language for programming, and is designed to meet the needs of the most demanding applications.
The XC4013E-2BGG225C chip model offers a number of advantages over other chip models, including its high-performance processing capabilities, low power consumption, and small size. It is also designed with advanced features such as a high-speed bus interface, a multi-core processor, and a multi-threaded processor, making it ideal for a wide range of applications.
The XC4013E-2BGG225C chip model is expected to be in high demand in the future, due to its ability to meet the needs of the most demanding applications. Its high performance and low power consumption make it an attractive option for a wide range of applications, including embedded processing, image processing, and digital signal processing.
The application environment for the XC4013E-2BGG225C chip model may require the support of new technologies, depending on the specific technologies needed. For example, if the application requires high-speed data transfer, the chip model may require the use of a high-speed bus interface. Similarly, if the application requires advanced features such as multi-core processing and multi-threaded processing, the chip model may require the use of a multi-core processor and a multi-threaded processor.
The XC4013E-2BGG225C chip model is expected to be in high demand in the future, as more applications require high-performance digital signal processing, embedded processing, and image processing. Its ability to meet the needs of the most demanding applications, combined with its low power consumption and small size, make it an attractive option for a wide range of applications. As the demand for these applications increases, the chip model is likely to be in high demand in the future.
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4,774 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $194.9101 | $194.9101 |
| 10+ | $192.8143 | $1,928.1434 |
| 100+ | $182.3353 | $18,233.5296 |
| 1000+ | $171.8563 | $85,928.1280 |
| 10000+ | $157.1856 | $157,185.6000 |
| The price is for reference only, please refer to the actual quotation! | ||