AMD Xilinx
XC4013E-1BGG225I
XC4013E-1BGG225I ECAD Model
XC4013E-1BGG225I Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 5 V | |
| Number of Equivalent Gates | 10000 | |
| Number of CLBs | 576 | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 576 CLBS, 10000 GATES | |
| Clock Frequency-Max | 166 MHz | |
| Supply Voltage-Max | 5.5 V | |
| Supply Voltage-Min | 4.5 V | |
| JESD-30 Code | S-PBGA-B225 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 3 | |
| Number of Terminals | 225 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | TIN SILVER COPPER | |
| Terminal Form | BALL | |
| Terminal Pitch | 1.5 mm | |
| Terminal Position | BOTTOM | |
| Width | 27 mm | |
| Length | 27 mm | |
| Seated Height-Max | 2.55 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | BGA, | |
| Pin Count | 225 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 |
XC4013E-1BGG225I Overview
The chip model XC4013E-1BGG225I is a powerful device that is suitable for high-performance digital signal processing, embedded processing, and image processing. It is designed to be used with the HDL language, which is a hardware description language that allows designers to describe their designs in a high-level language. This makes it easier to debug and optimize the design, as well as making it easier to port the design to different platforms.
The XC4013E-1BGG225I has several advantages that make it attractive to the industry. It has a low power consumption, making it ideal for battery-operated and low-power applications. It also has a high clock frequency, allowing it to process data quickly and efficiently. Additionally, it has a small form factor, making it easy to integrate into existing systems.
The demand for the XC4013E-1BGG225I is expected to grow in the future. As more companies and organizations look to reduce their power consumption and increase their processing speed, the XC4013E-1BGG225I will be a popular choice. It is also expected to be used in more advanced embedded systems, such as those used in autonomous vehicles and robotics.
The original design intention of the XC4013E-1BGG225I was to provide a powerful and efficient solution for digital signal processing, embedded processing, and image processing. The chip was designed to be used with the HDL language, which allows for easier debugging and optimization. The chip is also designed to be easily upgradable, allowing for future improvements and enhancements.
The XC4013E-1BGG225I can also be used in advanced communication systems. It has the ability to process large amounts of data quickly and efficiently, making it ideal for communication systems that require high speeds. Additionally, the chip is designed to be low power, making it suitable for systems that have to operate on battery power.
In conclusion, the XC4013E-1BGG225I is a powerful and efficient chip that is suitable for high-performance digital signal processing, embedded processing, and image processing. It is designed to be used with the HDL language, which makes it easier to debug and optimize the design. The chip is also designed to be upgradable, allowing for future improvements and enhancements. Additionally, it is suitable for advanced communication systems that require high speeds and low power consumption. The expected demand for the XC4013E-1BGG225I is likely to increase in the future, making it an attractive option for many industries.
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Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| No reference price found. | ||