AMD Xilinx
XC4013D-5PQ160C
XC4013D-5PQ160C ECAD Model
XC4013D-5PQ160C Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 5 V | |
| Number of Inputs | 192 | |
| Number of Outputs | 192 | |
| Number of Logic Cells | 576 | |
| Number of Equivalent Gates | 10000 | |
| Number of CLBs | 576 | |
| Combinatorial Delay of a CLB-Max | 4.5 ns | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 576 CLBS, 10000 GATES | |
| Additional Feature | 1536 FLIP-FLOPS; TYP. GATES = 10000-13000 | |
| Clock Frequency-Max | 133.3 MHz | |
| Power Supplies | 5 V | |
| Supply Voltage-Max | 5.25 V | |
| Supply Voltage-Min | 4.75 V | |
| JESD-30 Code | S-PQFP-G160 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | 225 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 160 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | QFP | |
| Package Equivalence Code | QFP160,1.2SQ | |
| Package Shape | SQUARE | |
| Package Style | FLATPACK | |
| Surface Mount | YES | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | GULL WING | |
| Terminal Pitch | 650 µm | |
| Terminal Position | QUAD | |
| Width | 28 mm | |
| Length | 28 mm | |
| Seated Height-Max | 3.92 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | QFP | |
| Package Description | PLASTIC, QFP-160 | |
| Pin Count | 160 | |
| Reach Compliance Code | not_compliant | |
| HTS Code | 8542.39.00.01 |
XC4013D-5PQ160C Datasheet Download
XC4013D-5PQ160C Overview
The XC4013D-5PQ160C chip model is a highly advanced integrated circuit that is designed to provide a wide range of features and functions for a variety of applications. This chip model is based on the latest technology and is capable of providing superior performance and reliability. It has a wide range of features, including high speed data processing, high-speed data transmission, low power consumption, and high-efficiency operation.
The XC4013D-5PQ160C chip model is designed to meet the needs of a variety of industries and applications. It is designed to provide superior performance and reliability for a wide range of applications, including communications, industrial, automotive, and medical applications. The chip model is also designed to be easily upgradeable, allowing it to be used in more advanced systems and applications.
The XC4013D-5PQ160C chip model is designed to meet the specific design requirements of each application. It is designed to provide the highest performance and reliability while minimizing power consumption. The chip model is designed to be easily upgradeable, allowing it to be used in more advanced systems and applications. The chip model is also designed to be highly reliable, allowing it to be used in a wide range of applications without fear of failure.
The XC4013D-5PQ160C chip model is expected to have a large demand in the future, as it is designed to meet the needs of a variety of industries and applications. It is expected to be used in a wide range of applications, including communications, industrial, automotive, and medical applications. The chip model is also expected to be easily upgradeable, allowing it to be used in more advanced systems and applications.
The XC4013D-5PQ160C chip model is designed to provide superior performance and reliability and is expected to be widely used in a variety of industries and applications. There are a number of case studies that have been conducted to demonstrate the capabilities and performance of the chip model. In addition, there are a number of precautions that should be taken when using the chip model, including proper installation, proper power supply, and proper grounding.
In conclusion, the XC4013D-5PQ160C chip model is a highly advanced integrated circuit that is designed to provide superior performance and reliability for a wide range of applications. It is designed to be easily upgradeable, allowing it to be used in more advanced systems and applications. The chip model is expected to have a large demand in the future, as it is designed to meet the needs of a variety of industries and applications. There are a number of case studies that have been conducted to demonstrate the capabilities and performance of the chip model, as well as a number of precautions that should be taken when using the chip model.
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5,200 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $41.8500 | $41.8500 |
| 10+ | $41.4000 | $414.0000 |
| 100+ | $39.1500 | $3,915.0000 |
| 1000+ | $36.9000 | $18,450.0000 |
| 10000+ | $33.7500 | $33,750.0000 |
| The price is for reference only, please refer to the actual quotation! | ||