
AMD Xilinx
XC4013D-5BG225I
XC4013D-5BG225I ECAD Model
XC4013D-5BG225I Attributes
Type | Description | Select |
---|---|---|
Rohs Code | No | |
Part Life Cycle Code | Obsolete | |
Supply Voltage-Nom | 5 V | |
Number of Inputs | 192 | |
Number of Outputs | 192 | |
Number of Logic Cells | 1368 | |
Number of Equivalent Gates | 10000 | |
Number of CLBs | 576 | |
Combinatorial Delay of a CLB-Max | 4.5 ns | |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
Temperature Grade | INDUSTRIAL | |
Package Shape | SQUARE | |
Technology | CMOS | |
Organization | 576 CLBS, 10000 GATES | |
Additional Feature | 1536 FLIP-FLOPS; TYP. GATES = 10000-13000 | |
Clock Frequency-Max | 133.3 MHz | |
Power Supplies | 5 V | |
Supply Voltage-Max | 5.5 V | |
Supply Voltage-Min | 4.5 V | |
JESD-30 Code | S-PBGA-B225 | |
Qualification Status | Not Qualified | |
JESD-609 Code | e0 | |
Moisture Sensitivity Level | 3 | |
Operating Temperature-Max | 85 °C | |
Operating Temperature-Min | -40 °C | |
Peak Reflow Temperature (Cel) | 225 | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Number of Terminals | 225 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Equivalence Code | BGA225,15X15 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY | |
Surface Mount | YES | |
Terminal Finish | TIN LEAD | |
Terminal Form | BALL | |
Terminal Pitch | 1.5 mm | |
Terminal Position | BOTTOM | |
Width | 27 mm | |
Length | 27 mm | |
Seated Height-Max | 2.165 mm | |
Ihs Manufacturer | XILINX INC | |
Part Package Code | BGA | |
Package Description | PLASTIC, BGA-225 | |
Pin Count | 225 | |
Reach Compliance Code | not_compliant | |
HTS Code | 8542.39.00.01 |
XC4013D-5BG225I Datasheet Download
XC4013D-5BG225I Overview
The XC4013D-5BG225I chip model has been developed to offer a range of advantages that are expected to meet the demands of the related industries in the future. This chip model is designed to be highly efficient, offering an optimal performance that is tailored to meet the needs of the industry. It is also designed to be cost-effective, making it an attractive choice for businesses that are looking to save money and maximize their profits.
In terms of its potential applications in networks, the XC4013D-5BG225I chip model has the capability to be used in a variety of intelligent scenarios. This chip model is designed to be able to connect and communicate with other devices, allowing it to be used in a variety of intelligent scenarios. It also has the capability to be used in the era of fully intelligent systems, allowing it to be used in scenarios where multiple devices are connected and communicating with each other.
The product description and design requirements of the XC4013D-5BG225I chip model have been carefully considered to ensure that it meets the needs of the industry. This chip model is designed to provide a high level of performance, while also being cost-effective. It is also designed to be able to connect and communicate with other devices, allowing it to be used in a variety of intelligent scenarios.
In order to ensure that the XC4013D-5BG225I chip model is able to meet the needs of the industry, it is important to consider actual case studies and precautions. This chip model has been designed to be able to provide a high level of performance, while also being cost-effective. It is also important to consider the potential risks associated with the use of this chip model, as well as any potential problems that may arise.
Overall, the XC4013D-5BG225I chip model is designed to provide a range of advantages that are expected to meet the demands of the related industries in the future. It is designed to be highly efficient, cost-effective, and able to connect and communicate with other devices. It is also important to consider actual case studies and precautions in order to ensure that the chip model is able to meet the needs of the industry.
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