XC4013D-5BG225I
XC4013D-5BG225I
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rohs

AMD Xilinx

XC4013D-5BG225I


XC4013D-5BG225I
F20-XC4013D-5BG225I
Active
FIELD PROGRAMMABLE GATE ARRAY, CMOS, PLASTIC, BGA-225
PLASTIC, BGA-225

XC4013D-5BG225I ECAD Model


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XC4013D-5BG225I Attributes


Type Description Select
Rohs Code No
Part Life Cycle Code Obsolete
Supply Voltage-Nom 5 V
Number of Inputs 192
Number of Outputs 192
Number of Logic Cells 1368
Number of Equivalent Gates 10000
Number of CLBs 576
Combinatorial Delay of a CLB-Max 4.5 ns
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Temperature Grade INDUSTRIAL
Package Shape SQUARE
Technology CMOS
Organization 576 CLBS, 10000 GATES
Additional Feature 1536 FLIP-FLOPS; TYP. GATES = 10000-13000
Clock Frequency-Max 133.3 MHz
Power Supplies 5 V
Supply Voltage-Max 5.5 V
Supply Voltage-Min 4.5 V
JESD-30 Code S-PBGA-B225
Qualification Status Not Qualified
JESD-609 Code e0
Moisture Sensitivity Level 3
Operating Temperature-Max 85 °C
Operating Temperature-Min -40 °C
Peak Reflow Temperature (Cel) 225
Time@Peak Reflow Temperature-Max (s) 30
Number of Terminals 225
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Equivalence Code BGA225,15X15
Package Shape SQUARE
Package Style GRID ARRAY
Surface Mount YES
Terminal Finish TIN LEAD
Terminal Form BALL
Terminal Pitch 1.5 mm
Terminal Position BOTTOM
Width 27 mm
Length 27 mm
Seated Height-Max 2.165 mm
Ihs Manufacturer XILINX INC
Part Package Code BGA
Package Description PLASTIC, BGA-225
Pin Count 225
Reach Compliance Code not_compliant
HTS Code 8542.39.00.01

XC4013D-5BG225I Datasheet Download


XC4013D-5BG225I Overview



The XC4013D-5BG225I chip model has been developed to offer a range of advantages that are expected to meet the demands of the related industries in the future. This chip model is designed to be highly efficient, offering an optimal performance that is tailored to meet the needs of the industry. It is also designed to be cost-effective, making it an attractive choice for businesses that are looking to save money and maximize their profits.


In terms of its potential applications in networks, the XC4013D-5BG225I chip model has the capability to be used in a variety of intelligent scenarios. This chip model is designed to be able to connect and communicate with other devices, allowing it to be used in a variety of intelligent scenarios. It also has the capability to be used in the era of fully intelligent systems, allowing it to be used in scenarios where multiple devices are connected and communicating with each other.


The product description and design requirements of the XC4013D-5BG225I chip model have been carefully considered to ensure that it meets the needs of the industry. This chip model is designed to provide a high level of performance, while also being cost-effective. It is also designed to be able to connect and communicate with other devices, allowing it to be used in a variety of intelligent scenarios.


In order to ensure that the XC4013D-5BG225I chip model is able to meet the needs of the industry, it is important to consider actual case studies and precautions. This chip model has been designed to be able to provide a high level of performance, while also being cost-effective. It is also important to consider the potential risks associated with the use of this chip model, as well as any potential problems that may arise.


Overall, the XC4013D-5BG225I chip model is designed to provide a range of advantages that are expected to meet the demands of the related industries in the future. It is designed to be highly efficient, cost-effective, and able to connect and communicate with other devices. It is also important to consider actual case studies and precautions in order to ensure that the chip model is able to meet the needs of the industry.



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