AMD Xilinx
XC4013D-4PQ160C
XC4013D-4PQ160C ECAD Model
XC4013D-4PQ160C Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | Active | |
| Supply Voltage-Nom | 5 V | |
| Number of Inputs | 192 | |
| Number of Outputs | 192 | |
| Number of Logic Cells | 576 | |
| Number of Equivalent Gates | 10000 | |
| Number of CLBs | 576 | |
| Combinatorial Delay of a CLB-Max | 4 ns | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 576 CLBS, 10000 GATES | |
| Additional Feature | 1536 FLIP-FLOPS; TYP. GATES = 10000-13000 | |
| Clock Frequency-Max | 133.3 MHz | |
| Power Supplies | 5 V | |
| Supply Voltage-Max | 5.25 V | |
| Supply Voltage-Min | 4.75 V | |
| JESD-30 Code | S-PQFP-G160 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | 225 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 160 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | QFP | |
| Package Equivalence Code | QFP160,1.2SQ | |
| Package Shape | SQUARE | |
| Package Style | FLATPACK | |
| Surface Mount | YES | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | GULL WING | |
| Terminal Pitch | 650 µm | |
| Terminal Position | QUAD | |
| Width | 28 mm | |
| Length | 28 mm | |
| Seated Height-Max | 3.92 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | QFP | |
| Package Description | PLASTIC, QFP-160 | |
| Pin Count | 160 | |
| Reach Compliance Code | not_compliant | |
| HTS Code | 8542.39.00.01 |
XC4013D-4PQ160C Datasheet Download
XC4013D-4PQ160C Overview
The XC4013D-4PQ160C chip model is a powerful and versatile tool for digital signal processing, embedded processing, and image processing. It is designed to be used with a hardware description language (HDL) and offers a wide range of features that make it suitable for a variety of tasks.
The XC4013D-4PQ160C chip model is based on a high-performance, low-power architecture that can be used in a variety of applications. It offers high-speed signal processing, low latency, and low power consumption, making it an ideal choice for many applications. The chip model also offers a wide range of features such as on-chip memory, on-chip debug, and high-level programming language support. These features make the XC4013D-4PQ160C chip model an attractive choice for many applications.
The XC4013D-4PQ160C chip model is expected to be increasingly in demand in the future, as its features and capabilities make it an ideal choice for many applications. In particular, it is expected to be used in the development of networks, as well as for image processing and embedded processing. This chip model can be used for a variety of tasks, including data analysis, machine learning, and artificial intelligence. It is also expected to be used in the development of intelligent systems, as its powerful features make it suitable for a wide range of tasks.
In conclusion, the XC4013D-4PQ160C chip model is an ideal choice for many applications, due to its powerful features and capabilities. It is expected to be increasingly in demand in the future, as its features make it suitable for a variety of tasks, including networks, image processing, embedded processing, and intelligent systems. Its powerful features make it a great choice for the development of the fully intelligent systems of the future.
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Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| No reference price found. | ||