XC4013D-4BG225C
XC4013D-4BG225C
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rohs

AMD Xilinx

XC4013D-4BG225C


XC4013D-4BG225C
F20-XC4013D-4BG225C
Active
FIELD PROGRAMMABLE GATE ARRAY, CMOS, PLASTIC, BGA-225
PLASTIC, BGA-225

XC4013D-4BG225C ECAD Model


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XC4013D-4BG225C Attributes


Type Description Select
Rohs Code No
Part Life Cycle Code Obsolete
Supply Voltage-Nom 5 V
Number of Inputs 192
Number of Outputs 192
Number of Logic Cells 1368
Number of Equivalent Gates 10000
Number of CLBs 576
Combinatorial Delay of a CLB-Max 4 ns
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Temperature Grade OTHER
Package Shape SQUARE
Technology CMOS
Organization 576 CLBS, 10000 GATES
Additional Feature 1536 FLIP-FLOPS; TYP. GATES = 10000-13000
Clock Frequency-Max 133.3 MHz
Power Supplies 5 V
Supply Voltage-Max 5.25 V
Supply Voltage-Min 4.75 V
JESD-30 Code S-PBGA-B225
Qualification Status Not Qualified
JESD-609 Code e0
Moisture Sensitivity Level 3
Operating Temperature-Max 85 °C
Peak Reflow Temperature (Cel) 225
Time@Peak Reflow Temperature-Max (s) 30
Number of Terminals 225
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Equivalence Code BGA225,15X15
Package Shape SQUARE
Package Style GRID ARRAY
Surface Mount YES
Terminal Finish Tin/Lead (Sn63Pb37)
Terminal Form BALL
Terminal Pitch 1.5 mm
Terminal Position BOTTOM
Width 27 mm
Length 27 mm
Seated Height-Max 2.165 mm
Ihs Manufacturer XILINX INC
Part Package Code BGA
Package Description PLASTIC, BGA-225
Pin Count 225
Reach Compliance Code not_compliant
HTS Code 8542.39.00.01

XC4013D-4BG225C Datasheet Download


XC4013D-4BG225C Overview



The XC4013D-4BG225C chip model is a high-performance, low-power FPGA device that is suitable for a variety of digital signal processing, embedded processing, and image processing applications. The chip model is designed to be programmed using the HDL language, making it a versatile and powerful tool for a wide range of applications.


The XC4013D-4BG225C chip model is capable of handling complex data processing tasks, making it an ideal fit for a variety of network applications. It is capable of providing intelligent solutions for a variety of scenarios, such as facial recognition, object detection, and autonomous navigation. It is also capable of being used in the era of fully intelligent systems, such as self-driving cars and smart homes.


The XC4013D-4BG225C chip model is designed to be flexible and powerful, with a wide range of features and capabilities. It has a low power consumption, making it an ideal choice for applications that require energy efficiency. It also has a high-speed transceiver, allowing it to efficiently process large amounts of data. Additionally, the chip model has a wide range of configurable I/O pins, making it suitable for a variety of applications.


When designing with the XC4013D-4BG225C chip model, there are a few important considerations to keep in mind. It is important to ensure that the design meets the necessary power requirements, as the device is designed to be energy efficient. Additionally, it is important to ensure that the design is optimized for the specific application, as the device is highly configurable. Finally, it is important to ensure that the design is tested thoroughly before being deployed, as any errors in the design can be costly.


In conclusion, the XC4013D-4BG225C chip model is a powerful and versatile device that is suitable for a variety of applications. It is capable of providing intelligent solutions for a variety of scenarios, making it an ideal choice for network applications. It is important to keep in mind the design requirements and considerations when designing with the chip model, as any errors can be costly. With proper design and testing, the XC4013D-4BG225C chip model can be a powerful tool for a variety of applications.



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