AMD Xilinx
XC4013-6PQ160I
XC4013-6PQ160I ECAD Model
XC4013-6PQ160I Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 5 V | |
| Number of Inputs | 192 | |
| Number of Outputs | 192 | |
| Number of Logic Cells | 576 | |
| Number of Equivalent Gates | 10000 | |
| Number of CLBs | 576 | |
| Combinatorial Delay of a CLB-Max | 6 ns | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | INDUSTRIAL | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 576 CLBS, 10000 GATES | |
| Additional Feature | 1536 FLIP-FLOPS; TYP. GATES = 10000-13000 | |
| Clock Frequency-Max | 90.9 MHz | |
| Power Supplies | 5 V | |
| Supply Voltage-Max | 5.5 V | |
| Supply Voltage-Min | 4.5 V | |
| JESD-30 Code | S-PQFP-G160 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| Peak Reflow Temperature (Cel) | 225 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 160 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | QFP | |
| Package Equivalence Code | QFP160,1.2SQ | |
| Package Shape | SQUARE | |
| Package Style | FLATPACK | |
| Surface Mount | YES | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | GULL WING | |
| Terminal Pitch | 650 µm | |
| Terminal Position | QUAD | |
| Width | 28 mm | |
| Length | 28 mm | |
| Seated Height-Max | 3.92 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | QFP | |
| Package Description | PLASTIC, QFP-160 | |
| Pin Count | 160 | |
| Reach Compliance Code | not_compliant | |
| HTS Code | 8542.39.00.01 |
XC4013-6PQ160I Datasheet Download
XC4013-6PQ160I Overview
The XC4013-6PQ160I chip model is a state-of-the-art integrated circuit that has been designed to meet the needs of advanced communication systems. It has been developed by Xilinx, a leading provider of integrated circuit products, and is specifically designed for high-performance applications.
The XC4013-6PQ160I chip model integrates a wide range of features and functions into a single package. It is designed to provide a high-performance, low-power solution for advanced communication systems. It has the capability to support a wide range of protocols, including Ethernet, Wi-Fi, Bluetooth, and Zigbee. It also supports advanced signal processing, including digital signal processing (DSP) and analog signal processing (ASP).
The original design intention of the XC4013-6PQ160I chip model was to provide an advanced communication solution that could be used in a wide range of applications. It has been designed to provide a high-performance, low-power solution for advanced communication systems. It has the capability to support a wide range of protocols, including Ethernet, Wi-Fi, Bluetooth, and Zigbee. It also supports advanced signal processing, including digital signal processing (DSP) and analog signal processing (ASP).
The XC4013-6PQ160I chip model is capable of being upgraded to support future communication needs. It can be used for the development and popularization of future intelligent robots and other advanced applications. The chip model also has the capability to be used in a wide range of applications, from consumer electronics to industrial applications.
In order to use the XC4013-6PQ160I chip model effectively, it is important to have a good understanding of its features and capabilities. It is also important to have a good understanding of the design requirements and specific design considerations that need to be taken into account when using the chip model. Additionally, it is important to be aware of the potential risks and pitfalls that may be encountered when using the chip model.
In conclusion, the XC4013-6PQ160I chip model is a state-of-the-art integrated circuit that has been designed to meet the needs of advanced communication systems. It is capable of being upgraded to support future communication needs and can be used for the development and popularization of future intelligent robots and other advanced applications. In order to use the chip model effectively, it is important to have a good understanding of its features and capabilities, as well as the design requirements and specific design considerations that need to be taken into account when using the chip model. Additionally, it is important to be aware of the potential risks and pitfalls that may be encountered when using the chip model.
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|---|---|---|
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