XC4013-6PG223C
XC4013-6PG223C
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rohs

AMD Xilinx

XC4013-6PG223C


XC4013-6PG223C
F20-XC4013-6PG223C
Active
FIELD PROGRAMMABLE GATE ARRAY, CMOS, PGA, PGA223,18X18
PGA, PGA223,18X18

XC4013-6PG223C ECAD Model


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XC4013-6PG223C Attributes


Type Description Select
Rohs Code No
Part Life Cycle Code Obsolete
Supply Voltage-Nom 5 V
Number of Inputs 192
Number of Outputs 192
Number of Logic Cells 576
Number of Equivalent Gates 10000
Number of CLBs 576
Combinatorial Delay of a CLB-Max 6 ns
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Temperature Grade OTHER
Package Shape SQUARE
Technology CMOS
Organization 576 CLBS, 10000 GATES
Additional Feature 1536 FLIP-FLOPS; TYP. GATES = 10000-13000
Clock Frequency-Max 90.9 MHz
Power Supplies 5 V
Supply Voltage-Max 5.25 V
Supply Voltage-Min 4.75 V
JESD-30 Code S-CPGA-P223
Qualification Status Not Qualified
JESD-609 Code e0
Moisture Sensitivity Level 1
Operating Temperature-Max 85 °C
Number of Terminals 223
Package Body Material CERAMIC, METAL-SEALED COFIRED
Package Code PGA
Package Equivalence Code PGA223,18X18
Package Shape SQUARE
Package Style GRID ARRAY
Surface Mount NO
Terminal Finish TIN LEAD
Terminal Form PIN/PEG
Terminal Pitch 2.54 mm
Terminal Position PERPENDICULAR
Width 47.244 mm
Length 47.244 mm
Seated Height-Max 4.064 mm
Ihs Manufacturer XILINX INC
Part Package Code PGA
Package Description PGA, PGA223,18X18
Pin Count 223
Reach Compliance Code unknown
HTS Code 8542.39.00.01

XC4013-6PG223C Datasheet Download


XC4013-6PG223C Overview



The chip model XC4013-6PG223C is a highly advanced semiconductor device that is designed to meet the demands of the modern technological world. It is a 6-pin, single-package, low-power, high-performance device that is capable of providing a wide range of applications. It is designed to provide a high degree of flexibility and scalability, allowing it to be used in a variety of settings.


The XC4013-6PG223C is designed to be used in a wide range of communication systems, networks, and intelligent scenarios. Its flexibility and scalability make it ideal for use in advanced communication systems, such as 5G, LTE, and Wi-Fi. It is also suitable for use in networks that require high throughput, such as the Internet of Things (IoT). Furthermore, it is capable of being used in intelligent scenarios, such as machine learning, artificial intelligence, and robotics.


The XC4013-6PG223C is designed to be future-proof, allowing for the possibility of upgrades and new technologies to be implemented in the future. It is built with a high degree of flexibility and scalability, allowing it to be used in a wide range of settings and applications. Furthermore, it is designed to be compatible with the latest technologies, such as the 5G network and the Internet of Things (IoT). This allows for the chip model to be used in a variety of settings and applications, making it ideal for use in a wide range of industries.


The XC4013-6PG223C is designed to be used in the era of fully intelligent systems. It is capable of being used in a wide range of settings and applications, making it ideal for use in the era of fully intelligent systems. Furthermore, its flexibility and scalability make it ideal for use in a variety of settings and applications, allowing it to be used in a wide range of industries.


In conclusion, the XC4013-6PG223C is a highly advanced semiconductor device that is designed to meet the demands of the modern technological world. It is designed to provide a high degree of flexibility and scalability, allowing it to be used in a variety of settings. Furthermore, it is designed to be future-proof, allowing for the possibility of upgrades and new technologies to be implemented in the future. Finally, it is designed to be used in the era of fully intelligent systems, making it ideal for use in a wide range of industries.



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