XC4013-6BG225C
XC4013-6BG225C
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rohs

AMD Xilinx

XC4013-6BG225C


XC4013-6BG225C
F20-XC4013-6BG225C
Active
FIELD PROGRAMMABLE GATE ARRAY, CMOS, PLASTIC, BGA-225
PLASTIC, BGA-225

XC4013-6BG225C ECAD Model


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XC4013-6BG225C Attributes


Type Description Select
Rohs Code No
Part Life Cycle Code Obsolete
Supply Voltage-Nom 5 V
Number of Inputs 192
Number of Outputs 192
Number of Logic Cells 1368
Number of Equivalent Gates 10000
Number of CLBs 576
Combinatorial Delay of a CLB-Max 6 ns
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Temperature Grade OTHER
Package Shape SQUARE
Technology CMOS
Organization 576 CLBS, 10000 GATES
Additional Feature 1536 FLIP-FLOPS; TYP. GATES = 10000-13000
Clock Frequency-Max 90.9 MHz
Power Supplies 5 V
Supply Voltage-Max 5.25 V
Supply Voltage-Min 4.75 V
JESD-30 Code S-PBGA-B225
Qualification Status Not Qualified
JESD-609 Code e0
Moisture Sensitivity Level 3
Operating Temperature-Max 85 °C
Peak Reflow Temperature (Cel) 225
Time@Peak Reflow Temperature-Max (s) 30
Number of Terminals 225
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Equivalence Code BGA225,15X15
Package Shape SQUARE
Package Style GRID ARRAY
Surface Mount YES
Terminal Finish TIN LEAD
Terminal Form BALL
Terminal Pitch 1.5 mm
Terminal Position BOTTOM
Width 27 mm
Length 27 mm
Seated Height-Max 2.165 mm
Ihs Manufacturer XILINX INC
Part Package Code BGA
Package Description PLASTIC, BGA-225
Pin Count 225
Reach Compliance Code not_compliant
HTS Code 8542.39.00.01

XC4013-6BG225C Datasheet Download


XC4013-6BG225C Overview



The XC4013-6BG225C chip is a high-performance, low-power device designed for digital signal processing, embedded processing, and image processing applications. It is a powerful and versatile device that can be used in a wide range of applications, including high-end computing, intelligent systems, and networks.


The XC4013-6BG225C chip utilizes a high-level hardware description language (HDL) to provide a more efficient and powerful platform for digital signal processing, embedded processing, and image processing applications. It is capable of performing complex operations at high speeds, making it an ideal choice for applications that require high performance and low power consumption.


The XC4013-6BG225C chip has a wide range of applications, from high-end computing and intelligent systems to networks. It is also suitable for the era of fully intelligent systems, as it can be used to create powerful and efficient systems. The chip can be used to create intelligent systems that can process large amounts of data and make decisions quickly and accurately.


When designing with the XC4013-6BG225C chip, it is important to understand the product specifications and design requirements. It is also important to consider the power consumption, speed, and other performance requirements of the application. Additionally, it is important to consider the scalability of the design and the ability to upgrade the system as needed.


To ensure the successful implementation of an XC4013-6BG225C-based system, it is important to consider the use of best practices and industry standards. Additionally, it is important to consider the use of simulation tools to ensure that the design meets the requirements of the application. Finally, it is important to consider the use of case studies and other resources to gain insight into the design and implementation of XC4013-6BG225C-based systems.


The XC4013-6BG225C chip is a powerful and versatile device that can be used in a wide range of applications. It is capable of performing complex operations at high speeds, making it an ideal choice for applications that require high performance and low power consumption. With the right design and implementation, the XC4013-6BG225C chip can be used to create powerful and efficient systems for the era of fully intelligent systems.



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