
AMD Xilinx
XC4013-6BG225C
XC4013-6BG225C ECAD Model
XC4013-6BG225C Attributes
Type | Description | Select |
---|---|---|
Rohs Code | No | |
Part Life Cycle Code | Obsolete | |
Supply Voltage-Nom | 5 V | |
Number of Inputs | 192 | |
Number of Outputs | 192 | |
Number of Logic Cells | 1368 | |
Number of Equivalent Gates | 10000 | |
Number of CLBs | 576 | |
Combinatorial Delay of a CLB-Max | 6 ns | |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
Temperature Grade | OTHER | |
Package Shape | SQUARE | |
Technology | CMOS | |
Organization | 576 CLBS, 10000 GATES | |
Additional Feature | 1536 FLIP-FLOPS; TYP. GATES = 10000-13000 | |
Clock Frequency-Max | 90.9 MHz | |
Power Supplies | 5 V | |
Supply Voltage-Max | 5.25 V | |
Supply Voltage-Min | 4.75 V | |
JESD-30 Code | S-PBGA-B225 | |
Qualification Status | Not Qualified | |
JESD-609 Code | e0 | |
Moisture Sensitivity Level | 3 | |
Operating Temperature-Max | 85 °C | |
Peak Reflow Temperature (Cel) | 225 | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Number of Terminals | 225 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Equivalence Code | BGA225,15X15 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY | |
Surface Mount | YES | |
Terminal Finish | TIN LEAD | |
Terminal Form | BALL | |
Terminal Pitch | 1.5 mm | |
Terminal Position | BOTTOM | |
Width | 27 mm | |
Length | 27 mm | |
Seated Height-Max | 2.165 mm | |
Ihs Manufacturer | XILINX INC | |
Part Package Code | BGA | |
Package Description | PLASTIC, BGA-225 | |
Pin Count | 225 | |
Reach Compliance Code | not_compliant | |
HTS Code | 8542.39.00.01 |
XC4013-6BG225C Datasheet Download
XC4013-6BG225C Overview
The XC4013-6BG225C chip is a high-performance, low-power device designed for digital signal processing, embedded processing, and image processing applications. It is a powerful and versatile device that can be used in a wide range of applications, including high-end computing, intelligent systems, and networks.
The XC4013-6BG225C chip utilizes a high-level hardware description language (HDL) to provide a more efficient and powerful platform for digital signal processing, embedded processing, and image processing applications. It is capable of performing complex operations at high speeds, making it an ideal choice for applications that require high performance and low power consumption.
The XC4013-6BG225C chip has a wide range of applications, from high-end computing and intelligent systems to networks. It is also suitable for the era of fully intelligent systems, as it can be used to create powerful and efficient systems. The chip can be used to create intelligent systems that can process large amounts of data and make decisions quickly and accurately.
When designing with the XC4013-6BG225C chip, it is important to understand the product specifications and design requirements. It is also important to consider the power consumption, speed, and other performance requirements of the application. Additionally, it is important to consider the scalability of the design and the ability to upgrade the system as needed.
To ensure the successful implementation of an XC4013-6BG225C-based system, it is important to consider the use of best practices and industry standards. Additionally, it is important to consider the use of simulation tools to ensure that the design meets the requirements of the application. Finally, it is important to consider the use of case studies and other resources to gain insight into the design and implementation of XC4013-6BG225C-based systems.
The XC4013-6BG225C chip is a powerful and versatile device that can be used in a wide range of applications. It is capable of performing complex operations at high speeds, making it an ideal choice for applications that require high performance and low power consumption. With the right design and implementation, the XC4013-6BG225C chip can be used to create powerful and efficient systems for the era of fully intelligent systems.
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