AMD Xilinx
XC4013-5BG225C
XC4013-5BG225C ECAD Model
XC4013-5BG225C Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 5 V | |
| Number of Inputs | 192 | |
| Number of Outputs | 192 | |
| Number of Logic Cells | 1368 | |
| Number of Equivalent Gates | 10000 | |
| Number of CLBs | 576 | |
| Combinatorial Delay of a CLB-Max | 4.5 ns | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 576 CLBS, 10000 GATES | |
| Additional Feature | 1536 FLIP-FLOPS; TYP. GATES = 10000-13000 | |
| Clock Frequency-Max | 133.3 MHz | |
| Power Supplies | 5 V | |
| Supply Voltage-Max | 5.25 V | |
| Supply Voltage-Min | 4.75 V | |
| JESD-30 Code | S-PBGA-B225 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | 225 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 225 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA225,15X15 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | BALL | |
| Terminal Pitch | 1.5 mm | |
| Terminal Position | BOTTOM | |
| Width | 27 mm | |
| Length | 27 mm | |
| Seated Height-Max | 2.165 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | PLASTIC, BGA-225 | |
| Pin Count | 225 | |
| Reach Compliance Code | not_compliant | |
| HTS Code | 8542.39.00.01 |
XC4013-5BG225C Datasheet Download
XC4013-5BG225C Overview
The chip model XC4013-5BG225C is a powerful and versatile integrated circuit that can be used for a variety of applications. It is suitable for high-performance digital signal processing, embedded processing, image processing, and other tasks that require the use of HDL language. The chip model is highly compatible and can be used in a wide range of industries.
The industry trends of the chip model XC4013-5BG225C and the future development of related industries are largely dependent on the specific technologies required for the application environment. New technologies may be needed to meet the demands of the application environment. As the chip model is highly compatible, it can be used in a variety of industries, from automotive to medical, and the potential applications of the chip model are vast.
The chip model XC4013-5BG225C can be applied to the development and popularization of future intelligent robots. As the chip model is highly compatible, it can be used in a variety of industries, from automotive to medical, and the potential applications of the chip model are vast. To use the chip model effectively, technical talents with knowledge of HDL language and the chip model are needed. Additionally, knowledge of robotics and artificial intelligence may be necessary to develop and popularize future intelligent robots.
In conclusion, the chip model XC4013-5BG225C is a powerful and versatile integrated circuit that can be used for a variety of applications. It is suitable for high-performance digital signal processing, embedded processing, image processing, and other tasks that require the use of HDL language. The chip model can be applied to the development and popularization of future intelligent robots, and technical talents with knowledge of HDL language, robotics, and artificial intelligence are needed to use the model effectively.
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| QTY | Unit Price | Ext Price |
|---|---|---|
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