
AMD Xilinx
XC40110XV-09HQ240I
XC40110XV-09HQ240I ECAD Model
XC40110XV-09HQ240I Attributes
Type | Description | Select |
---|---|---|
Rohs Code | No | |
Part Life Cycle Code | Obsolete | |
Supply Voltage-Nom | 2.5 V | |
Number of Inputs | 448 | |
Number of Outputs | 448 | |
Number of Logic Cells | 4096 | |
Number of Equivalent Gates | 75000 | |
Number of CLBs | 4096 | |
Combinatorial Delay of a CLB-Max | 1.3 ns | |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
Package Shape | SQUARE | |
Technology | CMOS | |
Organization | 4096 CLBS, 75000 GATES | |
Additional Feature | CAN ALSO USE 235000 GATES | |
Clock Frequency-Max | 225 MHz | |
Power Supplies | 2.5,3.3 V | |
Supply Voltage-Max | 2.7 V | |
Supply Voltage-Min | 2.3 V | |
JESD-30 Code | S-PQFP-G240 | |
Qualification Status | Not Qualified | |
JESD-609 Code | e0 | |
Moisture Sensitivity Level | 3 | |
Peak Reflow Temperature (Cel) | 225 | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Number of Terminals | 240 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | HFQFP | |
Package Equivalence Code | HQFP240,1.37SQ,20 | |
Package Shape | SQUARE | |
Package Style | FLATPACK, HEAT SINK/SLUG, FINE PITCH | |
Surface Mount | YES | |
Terminal Finish | TIN LEAD | |
Terminal Form | GULL WING | |
Terminal Pitch | 500 µm | |
Terminal Position | QUAD | |
Width | 32 mm | |
Length | 32 mm | |
Seated Height-Max | 4.1 mm | |
Ihs Manufacturer | XILINX INC | |
Part Package Code | QFP | |
Package Description | QFP-240 | |
Pin Count | 240 | |
Reach Compliance Code | unknown | |
HTS Code | 8542.39.00.01 |
XC40110XV-09HQ240I Datasheet Download
XC40110XV-09HQ240I Overview
The chip model XC40110XV-09HQ240I is a new model that has been gaining traction in the chip industry. It is a high-performance, low-power, and cost-effective solution for a wide range of applications. It is equipped with advanced features such as a 32-bit CPU, a high-speed memory controller, and an integrated video accelerator. It is also capable of supporting a wide range of communication protocols, including Ethernet, Wi-Fi, Bluetooth, and Zigbee.
The chip model XC40110XV-09HQ240I has been widely adopted in the industry due to its performance and cost-effectiveness. It is expected to continue to be popular in the future, as it can be used in a variety of applications. Potential applications include networks, intelligent systems, and embedded systems. It can be used to create networks that are reliable, secure, and high-performance. It is also capable of providing an excellent platform for intelligent systems, as it can be used to create intelligent scenarios that are efficient and cost-effective.
In the era of fully intelligent systems, the chip model XC40110XV-09HQ240I will be an invaluable asset. It can be used to create intelligent systems that are reliable, secure, and high-performance. It is also capable of providing a platform for a wide range of applications, including networks, intelligent systems, and embedded systems. As such, the chip model XC40110XV-09HQ240I will continue to be in high demand in the future.
In order to make the most of the chip model XC40110XV-09HQ240I, new technologies may be needed to support its applications. These new technologies may include advanced algorithms, artificial intelligence, and machine learning. Additionally, new technologies may also be needed to ensure that the chip model XC40110XV-09HQ240I can be used in the era of fully intelligent systems.
Overall, the chip model XC40110XV-09HQ240I is a powerful and cost-effective solution that has been gaining traction in the chip industry. It is expected to remain popular in the future, as it can be used in a variety of applications. Additionally, new technologies may be needed to support its applications in the era of fully intelligent systems. As such, the chip model XC40110XV-09HQ240I is an invaluable asset and will continue to be in high demand in the future.
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